参数资料
型号: IDT88P8341BHGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 17/96页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8341BHGI
24
IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
DATAPATH CONFIGURATION
A logical view of datapath configuration using Packet Fragment Processors
is shown in Figure 12, Logical View of Datapath Configuration Using PFPs.
Two PFPs are associated with each SPI-3 port, one for ingress and one for
egress.LogicalportsaremappedinternallyintoLogicalIdentifiers(“LIDs”,“LID
Map”)forthecontrolofeachper-LIDdataflowtoeachphysicalport,logicalport,
memory queue size, and backpressure threshold (watermark), by program-
ming the LID register files.
Figure 12. Logical view of datapath configuration using PFPs
LID - Logical Identifier
EN - LID enable flag
BRV - Bit reversal
LP - Logical port
PFP - Packet fragment processor
[LID] = LP | EN | BRV
SPI-3 Egress LID to LP Map
[LP] = LID | EN | BRV
SPI-3 Ingress LP to LID Map
[LID] = LP | EN
SPI-4 INGRESS DATA
SPI-4 EGRESS DATA
[LP] = LID | PPE | EN
LID
BRV
EN
LP
BRV
EN
LP
EN
256 LIDs
SPI-4 Egress LID to LP Map
PFP AND MEMORY
(ONE OF FOUR: ABCD)
PFP AND MEMORY
(ONE OF FOUR: ABCD)
PFP AND MEMORY
(ONE OF FOUR: ABCD)
PFP AND MEMORY
(ONE OF FOUR: ABCD)
PFP AND MEMORY
(ONE OF FOUR: ABCD)
PFP AND MEMORY
(ONE OF FOUR: ABCD)
SPI-3 INGRESS DATA
SPI-3 EGRESS DATA
PFP AND MEMORY
LID
EN
A/B
256 LPs
SPI-4 Ingress LP to LID Map
256 LPs
64 LIDs
6372 drw13
相关PDF资料
PDF描述
LFEC15E-4FN484C IC FPGA 10.2KLUTS 288I/O 484-BGA
IDT72V51446L7-5BBI IC FLOW CTRL MULTI QUEUE 256-BGA
LFEC15E-4F484C IC FPGA 10.2KLUTS 288I/O 484-BGA
LT3022IMSE-1.8#TRPBF IC REG LDO 1.8V 1A 16-MSOP
LT3022IMSE-1.5#TRPBF IC REG LDO 1.5V 1A 16-MSOP
相关代理商/技术参数
参数描述
IDT88P8341BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装