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| 型号： | IDT88P8341BHGI |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 24/96页 |
| 文件大小： | 0K |
| 描述： | IC SPI3-SPI4 EXCHANGE 820-PBGA |
| 标准包装： | 24 |
| 系列： | * |
| 其它名称： | 88P8341BHGI |
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IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
4.2 SPI-4 to SPI-3 datapath and flow control
TwoPacketFragmentProcessormodulesfromSPI4ingresstoSPI-3egress
are provided, all connected to one SPI-4 ingress interface.
PacketburstsfromtheSPI-4ingressarereceivedintotheSPI-4ingressport
buffers.Apacketfragmentprocessortransferscompletepacketburstsfromthe
SPI-4 ingress port buffers to memory segments previously reserved on a per-
LP basis in the buffer segment pool. The SPI-4 ingress port buffer watermarks
andtheper-LPfreebuffersegmentthresholdinformationiscombinedtoproduce
SPI-4 ingress FIFO status (per-LP starving, hungry, or satisfied) towards the
attachedSPI-4device.Per-LPbuffersegmentthresholdinformationisusedto
produce FIFO status information for the attached SPI-3 device. Packets or
packetfragmentsareforwardedtotheSPI-3interfacewhenapacketiscomplete
or a predefined number of bytes have been received. Packets or packet
fragments received on one SPI4 logical port are cross connected to an SPI3
logical port through an intermediate mapping to a Link identification, or LID. Its
modeofoperationissimilartotheSPI-3ingresstoSPI-4egresspacketfragment
processor, with the following differences:
1) The PFP4-3 data input has three sources, listed in descending priority:
SPI-4 buffers, redirect buffers, and insert buffers.
2) The PFP3-4 data output has only three destinations. There is no SPI-3
to SPI-4 redirect path.
Each SPI-3 interface feeds ingress buffer available or ingress buffer
unavailable status information to its packet fragment processor.
If the number of free segments available to a LP exceeds the starving
threshold,theSPI-4statusismovedtostarvingforthatLP.Ifthenumberoffree
segments available to a LP exceeds the hungry but not the starving threshold,
the SPI-4 status is moved to hungry for that LP. If the hungry threshold is not
exceeded, the SPI-4 FIFO status channel will indicate satisfied for that LP.
SPI-4 ingress to SPI-3 egress datapath
The following is a description of the path taken by a burst of data through the
device from the SPI-4 ingress to a SPI-3 egress.
Data enters on the SPI-4 ingress interface in bursts. Bursts are normally of
equallengthexceptthelastburstofapacketwhichmaybeshorter.Thecontrol
word is in-band with the data. Burst data enters a SPI-4 ingress buffer. SPI-4
LP address, error information, SOP, EOP are stored with the burst data. A SPI-
4 LP address is mapped to a Logical IDentifier (LID). The burst is stored in per
LID allocated buffer segments reserved from the buffer segment pool.
The appropriate SPI-3 egress control register (Table 80 - SPI-3 egress port
descriptor table (64 entries)) is consulted, and it determines to send this LID to
a prescribed SPI-3 egress port.
TheselectionofwhichLPistobetransmittednextisdependentonthestatus
of the LP and the availability of a complete fragment. Data is moved to the
appropriate SPI-3 egress buffer along with the LP address. SPI-3 LP address,
errorinformation,SOP,andEOPinformationisstoredwiththepacketfragment.
Next,dataistransmittedinpacketfragmentsovertheselectedSPI-3interface.
Figure 18. SPI-4 ingress to SPI-3 egress packet fragment processor
6372 drw19
FIFO Status
SPI4 Ingress
uP
capture
buffer
uP
insert
buffer
Associated
ingress PFP
SPI-3
redirect
buffers
buffer segment pool
SPI-3 egress port
buffers
SPI-4 ingress port
buffers
FIFO Status
Egress
SPI-3
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相关代理商/技术参数 |
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|---|---|
| IDT88P8341BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT88P8342BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT88P8342BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT88P8344 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0 |
| IDT88P8344BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
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