参数资料
型号: IDT88P8341BHGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 26/96页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8341BHGI
32
IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
SPI-4 ingress to SPI-3 egress flow control
The SPI-4 control information is transmitted to the adjacent device. The
adjacent device determines which LP to service next according to the status
information it receives from the IDT88P8341. The SPI-4 ingress data arrive in
bursts that are of equal length except for the last burst of a packet which may
be shorter.
The SPI-4 burst data is transferred to the per LID allocated buffer segments.
The addition of the data may cause an update of the SPI-4 status information
(starving,hungry,satisfied),andmaychangetheSPI-3STPA,DTPA,orPTPA
signals when in PHY mode.
Forthecontrolinformationtherearetwoseparatecasestoconsider:thecase
thattheSPI-3isconfiguredtoLinkmode,andthecasethattheSPI-3isconfigured
to PHY mode.
When in PHY mode, the data is sent according the availability of the data in
the buffer segment pool. In the Link mode an extra consideration is taken to
account – that of the fill level of the ingress FIFOs in the adjacent device.
Backpressure threshold
- Number of free segments allocated to trigger backpressure for the LP
The diagram below shows the SPI-4 to SPI-3 flow control path through the
IDT88P8341 device.
Figure 20. SPI-4 ingress to SPI-3 egress flow control
JTAG
uproc
LID Counters Memory
SPI-3
8 bit / 32 bit
Min: 19.44MHz
Max: 133MHz
Interface
Bloc
k
Chip Counters Memory
Interface
Bloc
k
SPI-3 /
LID map
Main
Memory
A
SPI-4.2
Min: 80 MHz
Max:400 MHz
SPI-4 /
LID map
6372 drw21
STATUS
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相关代理商/技术参数
参数描述
IDT88P8341BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装