参数资料
型号: IDT88P8341BHGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 20/96页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8341BHGI
27
IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
SPI-4 egress data bursts
The PFP produces fragments of up to N*16 bytes. N is defined by the
MAX_BURST_HorMAX_BURST_SparameterassociatedwitheachLID.For
a high priority (starving) LID the MAX_BURST_S parameter is used. For a low
priority (hungry) LID the MAX_BURST_H parameter is used. The PFP may
not fill the buffers to the level granted when a new segment needs to be used
intheSPI3-4buffermemoryorwhenthelastfragmentofapacketiscopiedinto
thebuffer.TheinformationreceivedovertheFIFOstatuschannelisinterpreted
as status or credit information as selected by the CREDIT_EN flag in Table 78,
SPI-3 to SPI-4 flow control register (0x01). If the status mode is used, data will
be egressed until the status is changed. If the credit mode is used, the SPI-4
egresswillissueonlyonecredit’sworthdataburstandthenwaitforanothercredit
from the status channel before issuing another LID burst.
SPI-4 egress FIFO status channel updates
The SPI-4 egress FIFO Status Channel Module continuously verifies the
status information for the LIDs associated to SPI-4 logical ports. The PFP
searchesandselectsaLID,fetchestheassociatedinformationandqueuesdata
to the SPI-4 egress. The obsolete buffer segment is returned to the free buffer
segment pool (unless the repeat test feature is enabled). Searching the LID to
beservedisperformedforbothahighpriorityandalowpriorityLID.Thepriority
is defined by the status received from the SPI-4 egress module.
SPI-3 ingress logical port mapping
The SPI-3 interface has an associated SPI-3 ingress LP to LID map, (See
Table49)forthepurposeofdirectingthepacketfragmentsfromtheSPI-3ingress
to its associated SPI-3 ingress main memory buffer segment pool. The SPI-3
LID map has 256 entries, one per SPI-3 LP, but only 64 LPs are supported on
the SPI-3 interface at any one time. The SPI-3 interface has an enable bit, as
well as the ability to reverse the bit ordering within bytes of the interface. The
packetfragmentlengthisassociatedwiththeSPI-3interface.Theallowedrange
is0to255bytesperpacketfragment.Thelastfragmentofapacketcanbeshorter
than the programmed fragment size. The SPI-3 port can be independently set
for either Link or PHY mode of operation.
SPI-3 ingress LID associated control
EachLIDontheSPI-3interfacehastheabilitytobeprogrammedforminimum
and maximum packet length. The minimum packet length can be set from 0 to
255bytesinonebyteincrements.Themaximumpacketlengthcanbesetfrom
0to16,383bytesinonebyteincrements.EachLIDcanbeenabledanddisabled
independently.
Figure 14. SPI-3 ingress LP to LID map
6372 drw15
LID
BRV
EN
256 LPs
[LP] = LID | EN | BRV
LID: Logical Identifier
EN: LID Enable
BRV: Bit Reversal
相关PDF资料
PDF描述
LFEC15E-4FN484C IC FPGA 10.2KLUTS 288I/O 484-BGA
IDT72V51446L7-5BBI IC FLOW CTRL MULTI QUEUE 256-BGA
LFEC15E-4F484C IC FPGA 10.2KLUTS 288I/O 484-BGA
LT3022IMSE-1.8#TRPBF IC REG LDO 1.8V 1A 16-MSOP
LT3022IMSE-1.5#TRPBF IC REG LDO 1.5V 1A 16-MSOP
相关代理商/技术参数
参数描述
IDT88P8341BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装