参数资料
型号: IDT88P8341BHGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 30/96页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8341BHGI
36
IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
4.3.4 SPI-4 ingress to microprocessor interface
datapath
The diagram below shows the datapath through the device from the SPI-4
interface to the microprocessor data capture interface.
The following is a description of the path taken by a burst of data through the
device.
Data enters on the SPI-4 interface in bursts. Bursts are normally of equal
length except the last burst of a packet which may be shorter. The control word
is in-band with the data. The burst data enters a SPI-4 ingress buffer. SPI-4 LP
address,errorinformation,SOP,andEOParestoredalongwiththeburstdata.
The SPI-4 LP address is mapped to a LID. Data is stored in per-LID allocated
buffer segments. The DIRECTION field of the SPI-3 egress port descriptor
(Block_base 0x1700 + Register_offset 0x00 - 0xFF) is used to send this LID
data to the microprocessor port. Data is moved to the capture buffer along with
the LP address, LID, error information, SOP, and EOP.
ThedataavailablebitissetbythePFP.Dataandcontrolinformationareread
from the capture buffer through the microprocessor interface.
Figure 28. SPI-4 ingress to microprocessor data capture interface path
Figure 27. Microprocessor data capture buffer
6372 drw22
flags
length
data[1]
data[2]
data[255]
lid
data[0]
SOP
EA
ED
PAR
EOP
not used
EA
ED
PAR
data parity error
address parity error
packet error
70
inser
tsequence
t
t+1
t+258
e
xtr
act
sequence
t
t+1
t+258
JTAG
uproc
LID Counters Memory
SPI-3
8 bit / 32 bit
Min: 19.44MHz
Max: 133MHz
Interface
Bloc
k
Chip Counters Memory
Interface
Bloc
k
SPI-3 /
LID map
Main
Memory
A
SPI-4.2
Min: 80 MHz
Max:400 MHz
SPI-4 /
LID map
6372 drw26
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相关代理商/技术参数
参数描述
IDT88P8341BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装