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| 型号： | IDT88P8341BHGI |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 23/96页 |
| 文件大小： | 0K |
| 描述： | IC SPI3-SPI4 EXCHANGE 820-PBGA |
| 标准包装： | 24 |
| 系列： | * |
| 其它名称： | 88P8341BHGI |
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IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
Table of Contents (Continued)
9.3 Indirect registers for SPI-3A module .................................................................................................................................................................. 54
9.3.1 Block base 0x0000 registers ................................................................................................................................................................. 55
9.3.2 Block base 0x0200 registers ................................................................................................................................................................. 55
9.3.3 Block base 0x0500 registers ................................................................................................................................................................. 56
9.3.4 Block base 0x0700 registers ................................................................................................................................................................. 57
9.3.5 Block base 0x0A00 registers ................................................................................................................................................................. 59
9.3.6 Block base 0x0C00 registers ................................................................................................................................................................. 59
9.3.7 Block base 0x0100 registers ................................................................................................................................................................. 62
9.3.8 Block base 0x1100 registers .................................................................................................................................................................. 62
9.3.9 Block base 0x1200 registers ................................................................................................................................................................. 62
9.3.10 Block base 0x1300 registers ............................................................................................................................................................... 63
9.3.11 Block base 0x1600 registers ................................................................................................................................................................ 64
9.3.12 Block base 0x1700 registers ............................................................................................................................................................... 64
9.3.13 Block base 0x1800 registers ............................................................................................................................................................... 64
9.3.14 Block base 0x1900 registers ............................................................................................................................................................... 65
9.4 Common module indirect registers (Module_base 0x8000) ............................................................................................................................... 66
9.4.1 Common module block base 0x0000 registers ....................................................................................................................................... 67
9.4.2 Common module block base 0x0100 registers ....................................................................................................................................... 67
9.4.3 Common module block base 0x0200 registers ....................................................................................................................................... 67
9.4.4 Common module block base 0x0300 registers ....................................................................................................................................... 67
9.4.5 Common module block base 0x0400 registers ....................................................................................................................................... 70
9.4.6 Common module block base 0x0500 registers ....................................................................................................................................... 70
9.4.7 Common module block base 0x0600 registers ....................................................................................................................................... 71
9.4.8 Common module block base 0x0700 registers ....................................................................................................................................... 71
9.4.9 Common module block base 0x0800 registers ....................................................................................................................................... 73
10. JTAG interface ....................................................................................................................................................................................................... 77
11. Electrical and Thermal Specifications ................................................................................................................................................................ 77
11.1 Absolute maximum ratings ............................................................................................................................................................................... 77
11.2 Recommended Operating Conditions .............................................................................................................................................................. 77
11.3 Terminal Capacitance ..................................................................................................................................................................................... 78
11.4 Thermal Characteristics .................................................................................................................................................................................. 78
11.5 DC Electrical characteristics ............................................................................................................................................................................ 79
11.6 AC characteristics ........................................................................................................................................................................................... 80
11.6.1 SPI-3 I/O timing ................................................................................................................................................................................... 80
11.6.2 SPI-4 LVDS Input / Output ................................................................................................................................................................... 81
11.6.3 SPI-4 LVTTL Status AC characteristics ................................................................................................................................................. 82
11.6.4 REF_CLK clock input .......................................................................................................................................................................... 82
11.6.5 MCLK internal clock and OCLK[3:0] clock outputs ................................................................................................................................82
11.6.6 Microprocessor interface ..................................................................................................................................................................... 82
11.6.6.1 Microprocessor parallel port AC timing specifications .................................................................................................................. 83
11.6.6.2 Serial microprocessor interface (serial peripheral interface mode) .............................................................................................. 87
12. Mechanical characteristics .................................................................................................................................................................................. 88
12.1 Device overview ........................................................................................................................................................................................... 88
12.2 Pin name/ball location table ............................................................................................................................................................................ 89
12.3 Device package ............................................................................................................................................................................................. 92
13. Glossary ................................................................................................................................................................................................................ 94
14. Datasheet Document Revision History .............................................................................................................................................................. 95
15. Ordering information ........................................................................................................................................................................................... 96
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT88P8341BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT88P8342BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT88P8342BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT88P8344 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0 |
| IDT88P8344BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
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