参数资料
型号: MT42L64M32D1KL-3 IT:A
厂商: Micron Technology Inc
文件页数: 106/164页
文件大小: 0K
描述: IC DDR2 SDRAM 2GBIT 168FBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 LPDDR2 SDRAM
存储容量: 2G(64M x 32)
速度: 333MHz
接口: 并联
电源电压: 1.14 V ~ 1.3 V
工作温度: -25°C ~ 85°C
封装/外壳: 168-WFBGA
供应商设备封装: 168-FBGA(12x12)
包装: 散装
2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Truth Tables
Table 49: Command Truth Table (Continued)
Notes 1–11 apply to all parameters conditions
Command Pins
CKE
CA Pins
CK
Command
CK( n -1)
CK( n )
CS# CA0
CA1
CA2
CA3
CA4
CA5
CA6
CA7
CA8
CA9
Edge
NOP
Maintain PD,
SREF, DPD,
(NOP)
Enter power-
down
Exit PD, SREF,
DPD
H
H
L
L
H
X
L
X
H
H
L
L
L
L
H
H
H
X
H
X
H
X
H
X
X
X
X
X
X
X
X
X
Notes:
1. All commands are defined by the current state of CS#, CA0, CA1, CA2, CA3, and CKE at
the rising edge of the clock.
2. Bank addresses (BA) determine which bank will be operated upon.
3. AP HIGH during a READ or WRITE command indicates that an auto precharge will occur
to the bank associated with the READ or WRITE command.
4. X indicates a “Don’t Care” state, with a defined logic level, either HIGH (H) or LOW (L).
5. Self refresh exit and DPD exit are asynchronous.
6. V REF must be between 0 and V DDQ during self refresh and DPD operation.
7. CAxr refers to command/address bit “x” on the rising edge of clock.
8. CAxf refers to command/address bit “x” on the falling edge of clock.
9. CS# and CKE are sampled on the rising edge of the clock.
10. Per-bank refresh is only supported in devices with eight banks.
11. The least-significant column address C0 is not transmitted on the CA bus, and is inferred
to be zero.
Table 50: CKE Truth Table
Notes 1–5 apply to all parameters and conditions; L = LOW, H = HIGH, X = “Don’t Care”
Command
Current State
Active
CKE n -1
L
CKE n
L
CS#
X
n
X
Operation n
Maintain active power-down
Next State
Active
Notes
power-down
power-down
L
H
H
NOP
Exit active power-down
Active
6, 7
Idle power-down
L
L
X
X
Maintain idle power-down
Idle
power-down
L
H
H
NOP
Exit idle power-down
Idle
6, 7
Resetting idle
L
L
X
X
Maintain resetting power-down
Resetting
power-down
power-down
L
H
H
NOP
Exit resetting power-down
Idle or resetting 6, 7, 8
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
106
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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