参数资料
型号: MT42L64M32D1KL-3 IT:A
厂商: Micron Technology Inc
文件页数: 115/164页
文件大小: 0K
描述: IC DDR2 SDRAM 2GBIT 168FBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 LPDDR2 SDRAM
存储容量: 2G(64M x 32)
速度: 333MHz
接口: 并联
电源电压: 1.14 V ~ 1.3 V
工作温度: -25°C ~ 85°C
封装/外壳: 168-WFBGA
供应商设备封装: 168-FBGA(12x12)
包装: 散装
2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Electrical Specifications – I DD Specifications and Conditions
Table 57: Switching for I DD4R
Clock Cycle
Clock
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
CKE
H
H
H
H
H
H
H
H
CS#
L
L
H
H
L
L
H
H
Number
N
N
N +1
N+1
N+2
N+2
N+3
N+3
Command
Read_Rising
Read_Falling
NOP
NOP
Read_Rising
Read_Falling
NOP
NOP
CA[2:0]
HLH
LLL
LLL
HLH
HLH
LLL
LLL
HLH
CA[9:3]
LHLHLHL
LLLLLLL
LLLLLLL
LHLLHLH
LHLLHLH
HHHHHHH
HHHHHHH
LHLHLHL
All DQ
L
L
H
L
H
H
H
L
Notes:
1. Data strobe (DQS) is changing between HIGH and LOW with every clock cycle.
2. The noted pattern (N, N + 1...) is used continuously during I DD measurement for I DD4R .
Table 58: Switching for I DD4W
Clock Cycle
Clock
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
CKE
H
H
H
H
H
H
H
H
CS#
L
L
H
H
L
L
H
H
Number
N
N
N +1
N+1
N+2
N+2
N+3
N+3
Command
Write_Rising
Write_Falling
NOP
NOP
Write_Rising
Write_Falling
NOP
NOP
CA[2:0]
LLH
LLL
LLL
HLH
LLH
LLL
LLL
HLH
CA[9:3]
LHLHLHL
LLLLLLL
LLLLLLL
LHLLHLH
LHLLHLH
HHHHHHH
HHHHHHH
LHLHLHL
All DQ
L
L
H
L
H
H
H
L
Notes:
1. Data strobe (DQS) is changing between HIGH and LOW with every clock cycle.
2. Data masking (DM) must always be driven LOW.
3. The noted pattern (N, N + 1...) is used continuously during I DD measurement for I DD4W .
Table 59: I DD Specification Parameters and Operating Conditions
Notes 1–3 apply to all parameters and conditions
Parameter/Condition
Operating one bank active-precharge current (SDRAM): t CK = t CKmin;
t RC = t RCmin; CKE is HIGH; CS# is HIGH between valid commands; CA bus in-
puts are switching; Data bus inputs are stable
Symbol
I DD01
I DD02
I DD0in
Power Supply
V DD1
V DD2
V DDCA , V DDQ
Notes
4
Idle power-down standby current:
t CK
=
t CKmin;
CKE is LOW; CS# is HIGH;
I DD2P1
V DD1
All banks are idle; CA bus inputs are switching; Data bus inputs are stable
I DD2P2
V DD2
I DD2P,in
V DDCA , V DDQ
4
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
115
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
GSC60DTEI CONN EDGECARD 120POS .100 EYELET
MT42L64M32D1KL-25 IT:A IC DDR2 SDRAM 2GBIT 168FBGA
IDT71V67803S133BQG8 IC SRAM 9MBIT 133MHZ 165FBGA
IDT71V65803S150PFG IC SRAM 9MBIT 150MHZ 100TQFP
IDT71V67903S85BQI8 IC SRAM 9MBIT 85NS 165FBGA
相关代理商/技术参数
参数描述