参数资料
型号: MT42L64M32D1KL-3 IT:A
厂商: Micron Technology Inc
文件页数: 116/164页
文件大小: 0K
描述: IC DDR2 SDRAM 2GBIT 168FBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 LPDDR2 SDRAM
存储容量: 2G(64M x 32)
速度: 333MHz
接口: 并联
电源电压: 1.14 V ~ 1.3 V
工作温度: -25°C ~ 85°C
封装/外壳: 168-WFBGA
供应商设备封装: 168-FBGA(12x12)
包装: 散装
2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Electrical Specifications – I DD Specifications and Conditions
Table 59: I DD Specification Parameters and Operating Conditions (Continued)
Notes 1–3 apply to all parameters and conditions
Parameter/Condition
Idle power-down standby current with clock stop: CK = LOW, CK# =
HIGH; CKE is LOW; CS# is HIGH; All banks are idle; CA bus inputs are stable;
Data bus inputs are stable
Idle non-power-down standby current: t CK = t CKmin; CKE is HIGH; CS# is
HIGH; All banks are idle; CA bus inputs are switching; Data bus inputs are sta-
ble
Idle non-power-down standby current with clock stopped: CK = LOW;
CK# = HIGH; CKE is HIGH; CS# is HIGH; All banks are idle; CA bus inputs are
stable; Data bus inputs are stable
Symbol
I DD2PS1
I DD2PS2
I DD2PS,in
I DD2N1
I DD2N2
I DD2N,in
I DD2NS1
I DD2NS2
I DD2NS,in
Power Supply
V DD1
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
Notes
4
4
4
Active power-down standby current:
t CK
=
t CKmin;
CKE is LOW; CS# is
I DD3P1
V DD1
HIGH; One bank is active; CA bus inputs are switching; Data bus inputs are
stable
Active power-down standby current with clock stop: CK = LOW, CK# =
HIGH; CKE is LOW; CS# is HIGH; One bank is active; CA bus inputs are stable;
Data bus inputs are stable
Active non-power-down standby current: t CK = t CKmin; CKE is HIGH; CS#
is HIGH; One bank is active; CA bus inputs are switching; Data bus inputs are
stable
Active non-power-down standby current with clock stopped: CK =
LOW, CK# = HIGH CKE is HIGH; CS# is HIGH; One bank is active; CA bus inputs
are stable; Data bus inputs are stable
I DD3P2
I DD3P,in
I DD3PS1
I DD3PS2
I DD3PS,in
I DD3N1
I DD3N2
I DD3N,in
I DD3NS1
I DD3NS2
I DD3NS,in
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
4
4
4
4
Operating burst READ current:
t CK
=
t CKmin;
CS# is HIGH between valid
I DD4R1
V DD1
commands; One bank is active; BL = 4; RL = RL (MIN); CA bus inputs are
switching; 50% data change each burst transfer
I DD4R2
I DD4R,in
V DD2
V DDCA
I DD4RQ
V DDQ
5
Operating burst WRITE current:
t CK
=
t CKmin;
CS# is HIGH between valid
I DD4W1
V DD1
commands; One bank is active; BL = 4; WL = WLmin; CA bus inputs are switch-
ing; 50% data change each burst transfer
I DD4W2
I DD4W,in
V DD2
V DDCA , V DDQ
4
All-bank REFRESH burst current:
t CK
=
t CKmin;
CKE is HIGH between valid
I DD51
V DD1
commands; t RC = t RFCabmin; Burst refresh; CA bus inputs are switching; Data
bus inputs are stable
All-bank REFRESH average current: t CK = t CKmin; CKE is HIGH between
valid commands; t RC = t REFI; CA bus inputs are switching; Data bus inputs are
stable
I DD52
I DD5IN
I DD5AB1
I DD5AB2
I DD5AB,in
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
4
4
Per-bank REFRESH average current:
t CK
=
t CKmin;
CKE is HIGH between
I DD5PB1
V DD1
6
valid commands; t RC = t REFI/8; CA bus inputs are switching; Data bus inputs
are stable
I DD5PB2
I DD5PB,in
V DD2
V DDCA , V DDQ
6
4, 6
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
116
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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