参数资料
型号: ADUC7061BCPZ32-RL
厂商: Analog Devices Inc
文件页数: 8/108页
文件大小: 0K
描述: IC MCU 16/32BIT 32KB 32LFCSP
产品变化通告: ADuC7060/1 Idd Specification Change 01/Feb/2010
设计资源: USB Based Temperature Monitor Using ADuC7061 and an External RTD (CN0075)
4 mA-to-20 mA Loop-Powered Temperature Monitor Using ADuC7060/1 (CN0145)
标准包装: 5,000
系列: MicroConverter® ADuC7xxx
核心处理器: ARM7
芯体尺寸: 16/32-位
速度: 10MHz
连通性: I²C,SPI,UART/USART
外围设备: POR,PWM,温度传感器,WDT
输入/输出数: 8
程序存储器容量: 32KB(16K x 16)
程序存储器类型: 闪存
RAM 容量: 1K x 32
电压 - 电源 (Vcc/Vdd): 2.375 V ~ 2.625 V
数据转换器: A/D 5x24b,8x24b,D/A 1x14b
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 32-VFQFN 裸露焊盘,CSP
包装: 带卷 (TR)
Data Sheet
ADuC7060/ADuC7061
Rev. D | Page 105 of 108
OUTLINE DIMENSIONS
3.65
3.50 SQ
3.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
32
9
8
1
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
0.60 MAX
0.25 MIN
03-
28-
2012-
A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Figure 30. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-4)
Dimensions shown in millimeters
PIN 1
INDICATOR
TOP
VIEW
6.75
BSC SQ
7.00
BSC SQ
1
48
12
13
37
36
24
25
4.25
4.10 SQ
3.95
0.50
0.40
0.30
0.23
0.18
0.50 BSC
12° MAX
0.20 REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
5.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
PIN 1
INDICATOR
COPLANARITY
0.08
SEATING
PLANE
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
042809-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 31. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
(CP-48-3)
Dimensions shown in millimeters
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