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STANDARD PRODUCT
PM4351 COMET
DATA SHEET
PMC-1970624
ISSUE 10
COMBINED E1/T1 TRANSCEIVER
PROPRIETARY AND CONFIDENTIAL
458
18
ORDERING AND THERMAL INFORMATION
Table 123
- Ordering Information
Part No.
Description
PM4351-RI
PM4351-NI
80-Pin Metric Plastic Quad Flat Pack (MQFP)
81-Ball Chip Array Ball Grid Array (CABGA)
Table 124
- Thermal Information
Forced Air (Linear Feet per Minute)
Part No.
Case
Temperature
Theta J-A
Conv
100
200
300
400
500
Dense Board
1
62.1
54.8
49.1
45.0
42.4
41.1
PM4351-RI
-40
°
C to
85
°
C
JEDEC Board
2
43.2
40.7
39.2
38.5
38.2
38.0
Dense Board
3
99.5
92.9
87.8
84.0
81.0
78.5
PM4351-NI
-40
°
C to
85
°
C
JEDEC Board
4
47.8
45.8
44.4
43.5
43.0
42.7
1. - Dense Board is defined as a 3S3P board and consists of a 3x3 array of
PM4351-RI devices located as close to each other as board design rules allow. All
PM4351-RI devices are assumed to be dissipating 0.416 Watts. Theta J-A listed is
for the device in the middle of the array.
2. - JEDEC Board Theta J-A is the measured value for a single thermal device in the
same package on a 2S2P board following EIA/JESD 51-3.
3. - Dense Board is defined as a 3S3P board and consists of a 3x3 array of
PM4351-NI devices located as close to each other as board design rules allow. All
PM4351-NI devices are assumed to be dissipating 0.416 Watts. Theta J-A listed is
for the device in the middle of the array.
4. - JEDEC Board Theta J-A is the measured value for a single thermal device in the
same package on a 2S2P board following EIA/JESD 51-3.