参数资料
型号: MT48H32M16LFB4-75B IT:C
厂商: Micron Technology Inc
文件页数: 20/85页
文件大小: 0K
描述: IC SDRAM 512MB 54VFBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 SDRAM
存储容量: 512M(32Mx16)
速度: 133MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 54-VFBGA
供应商设备封装: 54-VFBGA(8x8)
包装: 散装

512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Electrical Specifications – AC Operating Conditions
Electrical Specifications – AC Operating Conditions
Table 12: Electrical Characteristics and Recommended AC Operating Conditions
Notes 1–5 apply to all parameters and conditions
AC Characteristics
-6
-75
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Access time from CLK (positive edge)
CL = 3
t AC
5
5.4
ns
CL = 2
8
8
Address hold time
Address setup time
CLK high-level width
CLK low-level width
t AH
t AS
t CH
t CL
1
1.5
2.5
2.5
1
1.5
2.5
2.5
ns
ns
ns
ns
Clock cycle time
CL = 3
t CK
6
7.5
ns
6
CL = 2
9.6
9.6
CKE hold time
CKE setup time
CS#, RAS#, CAS#, WE#, DQM hold time
CS#, RAS#, CAS#, WE#, DQM setup time
Data-in hold time
Data-in setup time
t CKH
t CKS
t CMH
t CMS
t DH
t DS
1
1.5
1
1.5
1
1.5
1
1.5
1
1.5
1
1.5
ns
ns
ns
ns
ns
ns
Data-out High-Z time
CL = 3
t HZ
5
5.4
ns
7
CL = 2
8
8
ns
Data-out Low-Z time
Data-out hold time (load)
Data-out hold time (no load)
ACTIVE-to-PRECHARGE command
t LZ
t OH
t OHn
t RAS
1
2.5
1.8
42
120,000
1
2.5
1.8
45
120,000
ns
ns
ns
ns
ACTIVE-to-ACTIVE command period
ACTIVE-to-READ or WRITE delay
Refresh period (8192 rows)
AUTO REFRESH period
PRECHARGE command period
ACTIVE bank a to ACTIVE bank b command
Transition time
WRITE recovery time
Exit SELF REFRESH-to-ACTIVE command
t RC
t RCD
t REF
t RFC
t RP
t RRD
t T
t WR
t XSR
60
18
72
18
2
0.3
15
120
64
1.2
67.5
19.2
72
19.2
2
0.3
15
120
64
1.2
ns
ns
ms
ns
ns
t CK
ns
ns
ns
8
9, 18
10
11
12
PDF: 09005aef8459c827
512mb_mobile_sdram_y67m_at.pdf – Rev. B 3/11 EN
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
? 2011 Micron Technology, Inc. All rights reserved.
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