参数资料
型号: MT48H32M16LFB4-75B IT:C
厂商: Micron Technology Inc
文件页数: 56/85页
文件大小: 0K
描述: IC SDRAM 512MB 54VFBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 SDRAM
存储容量: 512M(32Mx16)
速度: 133MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 54-VFBGA
供应商设备封装: 54-VFBGA(8x8)
包装: 散装

512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
WRITE Operation
WRITE Operation
WRITE bursts are initiated with a WRITE command, as shown in Figure 10 (page 30).
The starting column and bank addresses are provided with the WRITE command and
auto precharge is either enabled or disabled for that access. If auto precharge is ena-
bled, the row being accessed is precharged at the completion of the burst. For the ge-
neric WRITE commands used in the following figures, auto precharge is disabled.
During WRITE bursts, the first valid data-in element is registered coincident with the
WRITE command. Subsequent data elements are registered on each successive positive
clock edge. Upon completion of a fixed-length burst, assuming no other commands
have been initiated, the DQ will remain at High-Z and any additional input data will be
ignored (see Figure 26 (page 56)). A continuous page burst continues until terminated;
at the end of the page, it wraps to column 0 and continues.
Data for any WRITE burst can be truncated with a subsequent WRITE command, and
data for a fixed-length WRITE burst can be followed immediately by data for a WRITE
command. The new WRITE command can be issued on any clock following the previ-
ous WRITE command, and the data provided coincident with the new command ap-
plies to the new command (see Figure 27 (page 57)). Data n + 1 is either the last of a
burst of two or the last desired data element of a longer burst.
Mobile LPSDR devices use a pipelined architecture and therefore do not require the 2 n
rule associated with a prefetch architecture. A WRITE command can be initiated on any
clock cycle following a previous WRITE command. Full-speed random write accesses
within a page can be performed to the same bank, as shown in Figure 28 (page 58), or
each subsequent WRITE can be performed to a different bank.
Figure 26: WRITE Burst
T0
T1
T2
T3
CLK
Command
WRITE
NOP
NOP
NOP
Address
Bank,
Col n
DQ
D IN
n
D IN
n+1
Transitioning data
Don’t Care
Note:
1. BL = 2. DQM is LOW.
PDF: 09005aef8459c827
512mb_mobile_sdram_y67m_at.pdf – Rev. B 3/11 EN
56
Micron Technology, Inc. reserves the right to change products or specifications without notice.
? 2011 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
MT48H8M16LFB4-75 IT:K TR IC SDRAM 128MBIT 133MHZ 54VFBGA
MTC100-JA2-P34 CONTACT INSERT PIN
MX841BE IC CONVERTER WHITE LED 8-SOIC
MXHV9910BTR IC LED DRIVER HIGH BRIGHT 8-SOIC
MXN12FB12F MOTOR BRUSHED DC 12V 2922RPM
相关代理商/技术参数
参数描述