参数资料
型号: XC3S700A-4FT256I
厂商: Xilinx Inc
文件页数: 127/132页
文件大小: 0K
描述: IC FPGA SPARTAN 3 256FTBGA
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 1472
逻辑元件/单元数: 13248
RAM 位总计: 368640
输入/输出数: 161
门数: 700000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
Pinout Descriptions
94
DS529-4 (v2.0) August 19, 2010
FG320: 320-ball Fine-pitch Ball Grid Array
The 320-ball fine-pitch ball grid array package, FG320,
supports two Spartan-3A FPGAs, the XC3S200A and the
XC3S400A, as shown in Table 77 and Figure 23.
The FG320 package is an 18 x 18 array of solder balls
minus the four center balls.
Table 77 lists all the package pins. They are sorted by bank
number and then by pin name of the largest device. Pins
that form a differential I/O pair appear together in the table.
The table also shows the pin number for each pin and the
pin type, as defined earlier.
The shaded rows indicate pinout differences between the
XC3S200A and the XC3S400A FPGAs. The XC3S200A
has three unconnected balls, indicated as N.C. (No
Connection) in Table 77 and with the black diamond
character (
All other balls have nearly identical functionality on all three
devices. Table 80 summarizes the Spartan-3A FPGA
footprint migration differences for the FG320 package.
An electronic version of this package pinout table and
footprint diagram is available for download from the Xilinx
website at
Pinout Table
Table 77: Spartan-3A FG320 Pinout
Bank
Pin Name
FG320
Ball
Type
0
IO_L01N_0
C15
I/O
0
IO_L01P_0
C16
I/O
0
IO_L02N_0
A16
I/O
0
IO_L02P_0/VREF_0
B16
VREF
0
IO_L03N_0
A14
I/O
0
IO_L03P_0
A15
I/O
0
IO_L04N_0
C14
I/O
0
IO_L04P_0
B15
I/O
0
IO_L05N_0
D12
I/O
0
IO_L05P_0
C13
I/O
0
IO_L06N_0/VREF_0
A13
VREF
0
IO_L06P_0
B13
I/O
0
IO_L07N_0
B12
I/O
0
IO_L07P_0
C12
I/O
0
IO_L08N_0
F11
I/O
0
IO_L08P_0
E11
I/O
0
IO_L09N_0
A11
I/O
0
IO_L09P_0
B11
I/O
0
IO_L10N_0
D10
I/O
0
IO_L10P_0
C11
I/O
0
IO_L11N_0/GCLK5
C9
GCLK
0
IO_L11P_0/GCLK4
B10
GCLK
0
IO_L12N_0/GCLK7
B9
GCLK
0
IO_L12P_0/GCLK6
A10
GCLK
0
IO_L13N_0/GCLK9
B7
GCLK
0
IO_L13P_0/GCLK8
A8
GCLK
0
IO_L14N_0/GCLK11
C8
GCLK
0
IO_L14P_0/GCLK10
B8
GCLK
0
IO_L15N_0
C7
I/O
0
IO_L15P_0
D8
I/O
0
IO_L16N_0
E9
I/O
0
IO_L16P_0
D9
I/O
0
IO_L17N_0
B6
I/O
0
IO_L17P_0
A6
I/O
0
IO_L18N_0/VREF_0
A4
VREF
0
IO_L18P_0
A5
I/O
0
IO_L19N_0
E7
I/O
0
IO_L19P_0
F8
I/O
0
IO_L20N_0
D6
I/O
0
IO_L20P_0
C6
I/O
0
IO_L21N_0
A3
I/O
0
IO_L21P_0
B4
I/O
0
IO_L22N_0
D5
I/O
0
IO_L22P_0
C5
I/O
0
IO_L23N_0
A2
I/O
0
IO_L23P_0
B3
I/O
0
IO_L24N_0/PUDC_B
E5
DUAL
0
IO_L24P_0/VREF_0
E6
VREF
0
IP_0
D13
INPUT
0
IP_0
D14
INPUT
0
IP_0
E12
INPUT
0
XC3S400A: IP_0
XC3S200A: N.C. (
◆)
E13
INPUT
0
IP_0
F7
INPUT
0
IP_0
F9
INPUT
0
IP_0
F10
INPUT
Table 77: Spartan-3A FG320 Pinout(Continued)
Bank
Pin Name
FG320
Ball
Type
相关PDF资料
PDF描述
93LC76AT-E/SN IC EEPROM 8KBIT 2MHZ 8SOIC
XC2S100-6FG256C IC FPGA 2.5V C-TEMP 256-FBGA
24LC64T-E/OT IC EEPROM 64KBIT 400KHZ SOT23-5
24LC16B-E/MC IC EEPROM 16KBIT 400KHZ 8DFN
93LC76A-E/SN IC EEPROM 8KBIT 2MHZ 8SOIC
相关代理商/技术参数
参数描述
XC3S700A-4FTG256C 功能描述:IC FPGA SPARTAN-3A 256K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S700A-4FTG256I 功能描述:IC FPGA SPARTAN-3A 256K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
XC3S700A-5FG400C 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S700A-5FG484C 功能描述:IC SPARTAN-3A FPGA 700K 484FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S700A-5FGG400C 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)