参数资料
型号: XC3S700A-4FT256I
厂商: Xilinx Inc
文件页数: 13/132页
文件大小: 0K
描述: IC FPGA SPARTAN 3 256FTBGA
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 1472
逻辑元件/单元数: 13248
RAM 位总计: 368640
输入/输出数: 161
门数: 700000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
DS529-3 (v2.0) August 19, 2010
11
Copyright 2006–2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. PCI is a registered trademark of the PCI-SIG. All other trademarks are the property of their respective owners.
DC Electrical Characteristics
In this section, specifications may be designated as
Advance, Preliminary, or Production. These terms are
defined as follows:
Advance: Initial estimates are based on simulation, early
characterization, and/or extrapolation from the
characteristics of other families. Values are subject to
change. Use as estimates, not for production.
Preliminary: Based on characterization. Further changes
are not expected.
Production: These specifications are approved once the
silicon has been characterized over numerous production
lots. Parameter values are considered stable with no future
changes expected.
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. Unless
otherwise noted, the published parameter values apply
to all Spartan-3A devices. AC and DC characteristics
are specified using the same numbers for both
commercial and industrial grades.
Absolute Maximum Ratings
Stresses beyond those listed under Table 4: Absolute
Maximum Ratings may cause permanent damage to the
device. These are stress ratings only; functional operation
of the device at these or any other conditions beyond those
listed under the Recommended Operating Conditions is not
implied. Exposure to absolute maximum conditions for
extended periods of time adversely affects device reliability.
64
Spartan-3A FPGA Family:
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
0
Product Specification
Table 4: Absolute Maximum Ratings
Symbol
Description
Conditions
Min
Max
Units
VCCINT
Internal supply voltage
–0.5
1.32
V
VCCAUX
Auxiliary supply voltage
–0.5
3.75
V
VCCO
Output driver supply voltage
–0.5
3.75
V
VREF
Input reference voltage
–0.5
VCCO + 0.5
V
VIN
Voltage applied to all User I/O pins and
dual-purpose pins
Driver in a high-impedance state
–0.95
4.6
V
Voltage applied to all Dedicated pins
–0.5
4.6
V
IIK
Input clamp current per I/O pin
–0.5V < VIN < (VCCO + 0.5V)(1)
–±100
mA
VESD
Electrostatic Discharge Voltage
Human body model
±2000
V
Charged device model
–±500
V
Machine model
–±200
V
TJ
Junction temperature
–125
°C
TSTG
Storage temperature
–65
150
°C
Notes:
1.
Upper clamp applies only when using PCI IOSTANDARDs.
2.
For soldering guidelines, see UG112: Device Packaging and Thermal Characteristics and XAPP427: Implementation and Solder Reflow
Guidelines for Pb-Free Packages.
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