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型号： XC3S700A-4FT256I
厂商： Xilinx Inc
文件页数： 56/132页
文件大小： 0K
描述： IC FPGA SPARTAN 3 256FTBGA
标准包装： 90
系列： Spartan®-3A
LAB/CLB数： 1472
逻辑元件/单元数： 13248
RAM 位总计： 368640
输入/输出数： 161
门数： 700000
电源电压： 1.14 V ~ 1.26 V
安装类型： 表面贴装
工作温度： -40°C ~ 100°C
封装/外壳： 256-LBGA
供应商设备封装： 256-FTBGA
DS529-1 (v2.0) August 19, 2010
www.xilinx.com
3
Copyright 2006–2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. PCI is a registered trademark of the PCI-SIG. All other trademarks are the property of their respective owners.
Introduction
The Spartan-3A family of Field-Programmable Gate
Arrays (FPGAs) solves the design challenges in most
high-volume,
cost-sensitive,
I/O-intensive
electronic
applications. The five-member family offers densities ranging
from 50,000 to 1.4 million system gates, as shown in Table 1.
The
Spartan-3A FPGAs
are
part of
the
Extended
Spartan-3A family, which also include the non-volatile
Spartan-3AN and the higher density Spartan-3A DSP
FPGAs. The Spartan-3A family builds on the success of the
earlier Spartan-3E and Spartan-3 FPGA families. New
features improve system performance and reduce the cost
of configuration. These Spartan-3A family enhancements,
combined with proven 90 nm process technology, deliver
more functionality and bandwidth per dollar than ever before,
setting the new standard in the programmable logic industry.
Because of their exceptionally low cost, Spartan-3A FPGAs
are ideally suited to a wide range of consumer electronics
applications, including broadband access, home networking,
display/projection, and digital television equipment.
The Spartan-3A family is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost,
lengthy development cycles, and the inherent inflexibility of
conventional ASICs, and permit field design upgrades.
Features
Very low cost, high-performance logic solution for
high-volume, cost-conscious applications
Dual-range VCCAUX supply simplifies 3.3V-only design
Suspend, Hibernate modes reduce system power
Multi-voltage, multi-standard SelectIO interface pins
Up to 502 I/O pins or 227 differential signal pairs
LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
Selectable output drive, up to 24 mA per pin
QUIETIO standard reduces I/O switching noise
Full 3.3V
± 10% compatibility and hot swap compliance
640+ Mb/s data transfer rate per differential I/O
LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O
with integrated differential termination resistors
Enhanced Double Data Rate (DDR) support
DDR/DDR2 SDRAM support up to 400 Mb/s
Fully compliant 32-/64-bit, 33/66 MHz PCI technology
support
Abundant, flexible logic resources
Densities up to 25,344 logic cells, including optional shift
register or distributed RAM support
Efficient wide multiplexers, wide logic
Fast look-ahead carry logic
Enhanced 18 x 18 multipliers with optional pipeline
IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM memory architecture
Up to 576 Kbits of fast block RAM with byte write enables
for processor applications
Up to 176 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
Clock skew elimination (delay locked loop)
Frequency synthesis, multiplication, division
High-resolution phase shifting
Wide frequency range (5 MHz to over 320 MHz)
Eight low-skew global clock networks, eight additional
clocks per half device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
Low-cost, space-saving SPI serial Flash PROM
x8 or x8/x16 BPI parallel NOR Flash PROM
Low-cost Xilinx Platform Flash with JTAG
Unique Device DNA identifier for design authentication
Load multiple bitstreams under FPGA control
Post-configuration CRC checking
Complete Xilinx ISE and WebPACK development
system software support plus Spartan-3A Starter Kit
MicroBlaze and PicoBlaze
embedded processors
Low-cost QFP and BGA packaging, Pb-free options
Common footprints support easy density migration
Compatible with select Spartan-3AN nonvolatile FPGAs
Compatible with higher density Spartan-3A DSP FPGAs
XA Automotive version available
8
Spartan-3A FPGA Family:
Introduction and Ordering Information
DS529-1 (v2.0) August 19, 2010
Product Specification
Table 1: Summary of Spartan-3A FPGA Attributes
Device
System
Gates
Equivalent
Logic Cells
CLB Array
(One CLB = Four Slices)
Distributed
RAM bits(1)
Block
RAM
bits(1)
Dedicated
Multipliers DCMs
Maximum
User I/O
Maximum
Differential
I/O Pairs
Rows Columns
CLBs
Slices
XC3S50A
50K
1,584
16
12
176
704
11K
54K
3
2
144
64
XC3S200A
200K
4,032
32
16
448
1,792
28K
288K
16
4
248
112
XC3S400A
400K
8,064
40
24
896
3,584
56K
360K
20
4
311
142
XC3S700A
700K
13,248
48
32
1,472
5,888
92K
360K
20
8
372
165
XC3S1400A
1400K
25,344
72
40
2,816
11,264
176K
576K
32
8
502
227
Notes:
1.
By convention, one Kb is equivalent to 1,024 bits.
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相关代理商/技术参数
参数描述
XC3S700A-4FTG256C 功能描述:IC FPGA SPARTAN-3A 256K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S700A-4FTG256I 功能描述:IC FPGA SPARTAN-3A 256K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28）
XC3S700A-5FG400C 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S700A-5FG484C 功能描述:IC SPARTAN-3A FPGA 700K 484FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S700A-5FGG400C 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
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