收藏本站
参数资料
型号： XC3S700A-4FT256I
厂商： Xilinx Inc
文件页数： 96/132页
文件大小： 0K
描述： IC FPGA SPARTAN 3 256FTBGA
标准包装： 90
系列： Spartan®-3A
LAB/CLB数： 1472
逻辑元件/单元数： 13248
RAM 位总计： 368640
输入/输出数： 161
门数： 700000
电源电压： 1.14 V ~ 1.26 V
安装类型： 表面贴装
工作温度： -40°C ~ 100°C
封装/外壳： 256-LBGA
供应商设备封装： 256-FTBGA
Pinout Descriptions
66
www.xilinx.com
DS529-4 (v2.0) August 19, 2010
Package Pins by Type
Each package has three separate voltage supply
inputs—VCCINT, VCCAUX, and VCCO—and a common
ground return, GND. The numbers of pins dedicated to
these functions vary by package, as shown in Table 58.
A majority of package pins are user-defined I/O or input
pins. However, the numbers and characteristics of these I/O
depend on the device type and the package in which it is
available, as shown in Table 59. The table shows the
maximum number of single-ended I/O pins available,
assuming that all I/O-, INPUT-, DUAL-, VREF-, and
CLK-type pins are used as general-purpose I/O. AWAKE is
counted here as a dual-purpose I/O pin. Likewise, the table
shows the maximum number of differential pin-pairs
available on the package. Finally, the table shows how the
total maximum user-I/Os are distributed by pin type,
including the number of unconnected—N.C.—pins on the
device.
Not all I/O standards are supported on all I/O banks. The left
and right banks (I/O banks 1 and 3) support higher output
drive current than the top and bottom banks (I/O banks 0
and 2). Similarly, true differential output standards, such as
LVDS, RSDS, PPDS, miniLVDS, and TMDS, are only
supported in the top or bottom banks (I/O banks 0 and 2).
Inputs are unrestricted. For more details, see the chapter
“Using I/O Resources” in UG331.
PWR
MGMT
Control and status pins for the power-saving Suspend mode. SUSPEND is a dedicated
pin and is powered by VCCAUX. AWAKE is a dual-purpose pin. Unless Suspend mode is
enabled in the application, AWAKE is available as a user-I/O pin.
SUSPEND, AWAKE
JTAG
Dedicated JTAG pin - 4 per device. Not available as a user-I/O pin. Every package has
four dedicated JTAG pins. These pins are powered by VCCAUX.
TDI, TMS, TCK, TDO
GND
Dedicated ground pin. The number of GND pins depends on the package used. All must
be connected.
GND
VCCAUX
Dedicated auxiliary power supply pin. The number of VCCAUX pins depends on the
package used. All must be connected. VCCAUX can be either 2.5V or 3.3V. Set on board
and using CONFIG VCCAUX constraint.
VCCAUX
VCCINT
Dedicated internal core logic power supply pin. The number of VCCINT pins depends on
the package used. All must be connected to +1.2V.
VCCINT
VCCO
Along with all the other VCCO pins in the same bank, this pin supplies power to the output
buffers within the I/O bank and sets the input threshold voltage for some I/O standards. All
must be connected.
VCCO_#
N.C.
This package pin is not connected in this specific device/package combination but may be
connected in larger devices in the same package.
N.C.
Notes:
1.
# = I/O bank number, an integer between 0 and 3.
Table 57: Types of Pins on Spartan-3A FPGAs(Continued)
Type / Color
Code
Description
Pin Name(s) in Type
Table 58: Power and Ground Supply Pins by Package
Package
VCCINT
VCCAUX
VCCO
GND
VQ100
4
3
6
13
TQ144
4
8
13
FT256 (50A/200A/400A)
6
4
16
28
FT256 (700A/1400A)
15
10
13
50
FG320
6
8
16
32
FG400
9
8
22
43
FG484
15
10
24
53
FG676
23
14
36
77
相关PDF资料
PDF描述
93LC76AT-E/SN IC EEPROM 8KBIT 2MHZ 8SOIC
XC2S100-6FG256C IC FPGA 2.5V C-TEMP 256-FBGA
24LC64T-E/OT IC EEPROM 64KBIT 400KHZ SOT23-5
24LC16B-E/MC IC EEPROM 16KBIT 400KHZ 8DFN
93LC76A-E/SN IC EEPROM 8KBIT 2MHZ 8SOIC
相关代理商/技术参数
参数描述
XC3S700A-4FTG256C 功能描述:IC FPGA SPARTAN-3A 256K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S700A-4FTG256I 功能描述:IC FPGA SPARTAN-3A 256K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28）
XC3S700A-5FG400C 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S700A-5FG484C 功能描述:IC SPARTAN-3A FPGA 700K 484FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S700A-5FGG400C 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*