参数资料
型号: MT46H16M32LFB5-6IT:C
元件分类: DRAM
英文描述: 16M X 32 DDR DRAM, PBGA90
封装: 13 X 8 MM, GREEN, PLASTIC, VFBGA-90
文件页数: 1/95页
文件大小: 3228K
Mobile Low-Power DDR SDRAM
MT46H32M16LF – 8 Meg x 16 x 4 Banks
MT46H16M32LF – 4 Meg x 32 x 4 Banks
MT46H16M32LG – 4 Meg x 32 x 4 Banks
Features
VDD/VDDQ = 1.70–1.95V
Bidirectional data strobe per byte of data (DQS)
Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
Differential clock inputs (CK and CK#)
Commands entered on each positive CK edge
DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
4 internal banks for concurrent operation
Data masks (DM) for masking write data; one mask
per byte
Programmable burst lengths (BL): 2, 4, 8, or 16
Concurrent auto precharge option is supported
Auto refresh and self refresh modes
1.8V LVCMOS-compatible inputs
Temperature-compensated self refresh (TCSR)
Partial-array self refresh (PASR)
Deep power-down (DPD)
Status read register (SRR)
Selectable output drive strength (DS)
Clock stop capability
64ms refresh
Table 1: Key Timing Parameters (CL = 3)
Speed Grade
Clock Rate
Access Time
-5
200 MHz
5.0ns
-54
185 MHz
5.0ns
-6
166 MHz
5.0ns
-75
133 MHz
6.0ns
Options
Marking
VDD/VDDQ
– 1.8V/1.8V
H
Configuration
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
32M16
– 16 Meg x 32 (4 Meg x 32 x 4 banks)
16M32
Addressing
– JEDEC-standard addressing
LF
– Reduced page size
LG
Plastic "green" package
– 60-ball VFBGA (8mm x 9mm)1
BF
– 90-ball VFBGA (8mm x 13mm)2
B5
Timing – cycle time
– 5ns @ CL = 3 (200 MHz)
-5
– 5.4ns @ CL = 3 (185 MHz)
-54
– 6ns @ CL = 3 (166 MHz)
-6
– 7.5ns @ CL = 3 (133 MHz)
-75
Power
– Standard IDD2/IDD6
None
– Low-power IDD2/IDD6
L
Operating temperature range
– Commercial (0 to +70C)
None
– Industrial (–40C to +85C)
IT
– Automotive (–40C to +105C)
AT
Design revision
:C
Notes: 1. Only available for x16 configuration.
2. Only available for x32 configuration.
Micron Confidential and Proprietary
Advance
512Mb: x16, x32 Mobile LPDDR SDRAM
Features
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. B 2/10 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2009 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.
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