参数资料
型号: MT46H16M32LFB5-6IT:C
元件分类: DRAM
英文描述: 16M X 32 DDR DRAM, PBGA90
封装: 13 X 8 MM, GREEN, PLASTIC, VFBGA-90
文件页数: 53/95页
文件大小: 3228K
Figure 21: Status Register Definition
Status register
I/O bus (CLK L->H edge)
9
7
6
5
4
3
8
2
1
Manufacturer ID
Reserved
Revision ID
Refresh Rate
S12
DQ11
S11
DQ10
S10
DQ9
S9
DQ8
S8
DQ7
S7
DQ6
S6
DQ5
S5
DQ4
S4
DQ3
S3
DQ2
S2
DQ1
S1
DQ0
S0
10
11
12
S2 S1
Manufacturer ID
Reserved
Samsung
Infineon
Elpida
Reserved
DQ14
DQ12
S14
DQ31...DQ16
S31..S16
Reserved1
13
14
31..16
0
S13
S3
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
Reserved
Winbond
Reserved
Micron
ESMT
NVM
S0
Width
Type
Density
DQ13
15
DQ15
S15
S6 S5
Revision ID
The manufacturer’s revision number starts at ‘0000’
and increments by ‘0001’ each time a change in the
specification (AC timings or feature set), IBIS (pull-
up or pull-down characteristics), or process occurs.
X
0
S4
...
S10 S9
Refresh Multiplier2
Reserved
2X
1X
Reserved
1
0
1
0
1
0
1
0
1
0
1
0
0.25X
S8
S7
Device Width
32 bits
1
0
S11
16 bits
Device Type
LPDDR2
1
0
S12
LPDDR
S15 S14
Density
1
0
1
0
1
0
1
0
1
0
1
0
S13
2GB
Reserved
1Gb
512Mb
256Mb
128Mb
Reserved
Notes: 1. Reserved bits should be set to 0 for future compatibility.
2. Refresh multiplier is based on the memory device on-board temperature sensor. Re-
quired average periodic refresh interval = tREFI × multiplier.
Micron Confidential and Proprietary
Advance
512Mb: x16, x32 Mobile LPDDR SDRAM
Status Read Register
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. B 2/10 EN
57
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2009 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
ML1I-65656L-100CB 32K X 8 STANDARD SRAM, 100 ns, CDIP28
M95160-MB6TP 2K X 8 SPI BUS SERIAL EEPROM, DSO8
M95160-WMB3T 2K X 8 SPI BUS SERIAL EEPROM, DSO8
MT45W2MV16BAFB-601WT 2M X 16 PSEUDO STATIC RAM, 60 ns, PBGA54
MT45W2MV16BAFB-706LIT 2M X 16 PSEUDO STATIC RAM, 70 ns, PBGA54
相关代理商/技术参数
参数描述