参数资料
型号: MT46H16M32LFB5-6IT:C
元件分类: DRAM
英文描述: 16M X 32 DDR DRAM, PBGA90
封装: 13 X 8 MM, GREEN, PLASTIC, VFBGA-90
文件页数: 69/95页
文件大小: 3228K
Data for any WRITE burst can be truncated by a subsequent PRECHARGE command, as
shown in Figure 42 (page 80) and Figure 43 (page 81). Note that only the data-in
pairs that are registered prior to the tWR period are written to the internal array, and
any subsequent data-in should be masked with DM, as shown in Figure 42 (page 80)
and Figure 43 (page 81). After the PRECHARGE command, a subsequent command to
the same bank cannot be issued until tRP is met.
Figure 32: Data Input Timing
tDQSS
tDQSH tWPST
tDH
tDS
tDQSL
tDSS3 tDSH2
tDSH2
tDSS3
CK
CK#
T01
T1
T1n
T2
T2n
T3
DIN
Don’t Care
Transitioning Data
tWPRE
tWPRES
DQS4
DQ
DM5
Notes: 1. WRITE command issued at T0.
2. tDSH (MIN) generally occurs during tDQSS (MIN).
3. tDSS (MIN) generally occurs during tDQSS (MAX).
4. For x16, LDQS controls the lower byte; UDQS controls the upper byte. For x32, DQS0 con-
trols DQ[7:0], DQS1 controls DQ[15:8], DQS2 controls DQ[23:16], and DQS3 controls
DQ[31:24].
5. For x16, LDM controls the lower byte; UDM controls the upper byte. For x32, DM0 con-
trols DQ[7:0], DM1 controls DQ[15:8], DM2 controls DQ[23:16], and DM3 controls
DQ[31:24].
Micron Confidential and Proprietary
Advance
512Mb: x16, x32 Mobile LPDDR SDRAM
WRITE Operation
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. B 2/10 EN
71
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2009 Micron Technology, Inc. All rights reserved.
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