![](http://datasheet.mmic.net.cn/170000/MT46H32M16LGBF-54LIT-C_datasheet_9466316/MT46H32M16LGBF-54LIT-C_2.png)
Table 2: Configuration Addressing
Architecture
32 Meg x 16
16 Meg x 32
Reduced Page Size
16 Meg x 32
Configuration
8 Meg x 16 x 4 banks
4 Meg x 32 x 4 banks
Refresh count
8K
Row addressing
8K A[12:0]
16K A[13:0]
Column addressing
1K A[9:0]
512 A[8:0]
256 A[7:0]
Figure 1: 512Mb Mobile LPDDR Part Numbering
MT 46 H 32M16 LF BF -6
IT :C
Micron Technology
Product Family
46 = Mobile LPDDR
Operating Voltage
H = 1.8/1.8V
Configuration
32 Meg x 16
16 Meg x 32
Addressing
LF = JEDEC-standard
LG = Reduced page size
Design Revision
:C = Third generation
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
AT = Automotive (–40°C to +105°C)
Power
Blank = Standard IDD2/IDD6
L = Low-power IDD2/IDD6
Cycle Time (CL = 3)
-5 = 5ns tCK
-54 = 5.4ns tCK
-6 = 6ns tCK
-75 = 7.5ns tCK
Package Codes
BF = 60-ball (8mm x 9mm) VFBGA, “green”
B5 = 90-ball (8mm x 13mm) VFBGA, “green”
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
Micron Confidential and Proprietary
Advance
512Mb: x16, x32 Mobile LPDDR SDRAM
Features
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. B 2/10 EN
2
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