参数资料
型号: W631GG6KB-12
厂商: Winbond Electronics
文件页数: 120/159页
文件大小: 0K
描述: IC DDR3 SDRAM 1GBIT 96WBGA
标准包装: 200
格式 - 存储器: RAM
存储器类型: DDR3 SDRAM
存储容量: 1G(64M x 16)
速度: 800MHz
接口: 并联
电源电压: 1.425 V ~ 1.575 V
工作温度: 0°C ~ 85°C
封装/外壳: 96-TFBGA
供应商设备封装: 96-WBGA(9x13)
包装: 托盘
W631GG6KB
10.11 Input/Output Capacitance
PARAMETER
SYMBOL
DDR3-1333
MIN. MAX.
DDR3-1600
MIN. MAX.
DDR3-1866
MIN. MAX.
UNIT
NOTES
Input/output capacitance
(DQ, DM, DQS, DQS#)
Input capacitance
(CK and CK#)
Delta of input capacitance
(CK and CK#)
Delta of Input/Output capacitance
(DQS and DQS#)
Input capacitance
(CTRL, ADD, CMD input-only pins)
Delta of input capacitance
(All CTRL input-only pins)
Delta of input capacitance
(All ADD/CMD input-only pins)
Delta of Input/output capacitance
(DQ, DM, DQS, DQS#)
Input/output capacitance of ZQ signal
C IO
C CK
C DCK
C DDQS
C I
C DI_CTRL
C DI_ADD_CMD
C DIO
C ZQ
1.4
0.8
0
0
0.75
-0.4
-0.4
-0.5
?
2.5
1.4
0.15
0.15
1.3
0.2
0.4
0.3
3
1.4
0.8
0
0
0.75
-0.4
-0.4
-0.5
?
2.3
1.4
0.15
0.15
1.3
0.2
0.4
0.3
3
1.4
0.8
0
0
0.75
-0.4
-0.4
-0.5
?
2.2
1.3
0.15
0.15
1.2
0.2
0.4
0.3
3
pF
pF
pF
pF
pF
pF
pF
pF
pF
1, 2, 3
2, 3
2, 3, 4
2, 3, 5
2, 3, 6
2, 3, 7, 8
2, 3, 9, 10
2, 3, 11
2, 3, 12
Notes:
1. Although the DM signals have different functions, the loading matches DQ and DQS.
2. This parameter is not subject to production test. It is verified by design and characterization. The capacitance is measured
according to JEP147 (Procedure for measuring input capacitance using a vector network analyzer (VNA) with V DD , V DDQ ,
V SS , V SSQ applied and all other pins floating (except the ball under test, CKE, RESET# and ODT as necessary).
V DD =V DDQ =1.5V, V BIAS =V DD /2 and on-die termination off.
3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here.
4. Absolute value of C CK -C CK #.
5. Absolute value of C IO (DQS)-C IO (DQS#).
6. C I applies to ODT, CS#, CKE, A0-A12, BA0-BA2, RAS#, CAS#, WE#.
7. C DI_CTRL applies to ODT, CS# and CKE.
8. C DI_CTRL =C I (CTRL)-0.5*(C I (CLK)+C I (CLK#)).
9. C DI_ADD_CMD applies to A0-A12, BA0-BA2, RAS#, CAS# and WE#.
10. C DI_ADD_CMD =C I (ADD_CMD) - 0.5*(C I (CLK)+C I (CLK#)).
11. C DIO =C IO(DQ,DM) - 0.5*(C IO(DQS) +C IO(DQS#) ).
12. Maximum external load capacitance on ZQ signal: 5 pF.
Publication Release Date: Dec. 09, 2013
Revision A05
- 120 -
相关PDF资料
PDF描述
AMC20DRAS-S734 CONN EDGECARD 40POS .100 R/A PCB
FMC12DREI-S13 CONN EDGECARD 24POS .100 EXTEND
EPF6024AQC240-2N IC FLEX 6000 FPGA 24K 240-PQFP
EPF6024AQC240-2 IC FLEX 6000 FPGA 24K 240-PQFP
EPF10K10QC208-3 IC FLEX 10K FPGA 10K 208-PQFP
相关代理商/技术参数
参数描述
W631GG6KB-15 功能描述:IC DDR3 SDRAM 1GBIT 96WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W631GG8KB-11 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 78WBGA
W631GG8KB-12 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR3 SDRAM 1G-Bit 128Mx8 1.5V 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 78WBGA
W631GG8KB-15 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 78WBGA
W632 制造商:LUMINIS 制造商全称:LUMINIS 功能描述:Wall mount