参数资料
| 型号： | W631GG6KB-12 |
| 厂商： | Winbond Electronics |
| 文件页数： | 9/159页 |
| 文件大小： | 0K |
| 描述： | IC DDR3 SDRAM 1GBIT 96WBGA |
| 标准包装： | 200 |
| 格式 - 存储器： | RAM |
| 存储器类型： | DDR3 SDRAM |
| 存储容量： | 1G（64M x 16） |
| 速度： | 800MHz |
| 接口： | 并联 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 96-TFBGA |
| 供应商设备封装： | 96-WBGA（9x13） |
| 包装： | 托盘 |
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W631GG6KB
6. BALL DESCRIPTION
BALL NUMBER
SYMBOL
TYPE
DESCRIPTION
Clock: CK and CK# are differential clock inputs. All address and
J7, K7
CK, CK#
Input
control input signals are sampled on the crossing of the positive edge
of CK and negative edge of CK#.
Clock Enable: CKE HIGH activates, and CKE Low deactivates,
internal clock signals and device input buffers and output drivers.
Taking CKE Low provides Precharge Power Down and Self-Refresh
operation (all banks idle), or Active Power Down (row Active in any
bank). CKE is asynchronous for Self-Refresh exit. After V REFCA and
K9
CKE
Input
V REFDQ have become stable during the power on and initialization
sequence, they must be maintained during all operations (including
Self-Refresh). CKE must be maintained high throughout read and
write accesses. Input buffers, excluding CK, CK#, ODT and CKE, are
disabled during power down. Input buffers, excluding CKE, are
disabled during Self-Refresh.
Chip Select: All commands are masked when CS# is registered HIGH.
L2
CS#
Input
CS# provides for external Rank selection on systems with multiple
Ranks. CS# is considered part of the command code.
On Die Termination: ODT (registered HIGH) enables termination
resistance internal to the DDR3 SDRAM. When enabled, ODT is
K1
ODT
Input
applied to each DQ, DQSU, DQSU#, DQSL, DQSL#, DMU, and DML
signal. The ODT signal will be ignored if Mode Registers MR1 and
MR2 are programmed to disable ODT and during Self Refresh.
J3, K3, L3
RAS#, CAS#,
WE#
Input
Command Inputs: RAS#, CAS# and WE# (along with CS#) define the
command being entered.
Input Data Mask: DMU and DML are the input mask signals control the
D3, E7
DMU, DML
Input
lower or upper bytes for write data. Input data is masked when
DMU/DML is sampled HIGH coincident with that input data during a
Write access. DM is sampled on both edges of DQS.
Bank Address Inputs: BA0 ? BA2 define to which bank an Active, Read,
M2, N8, M3
BA0 ? BA2
Input
Write, or Precharge command is being applied. Bank address also
determines which mode register is to be accessed during a MRS
cycle.
Address Inputs: Provide the row address for Active commands and the
column address for Read/Write commands to select one location out
N3, P7, P3, N2, P8,
P2, R8, R2, T8, R3,
L7, R7, N7
A0 ? A12
Input
of the memory array in the respective bank. (A10/AP and A12/BC#
have additional functions; see below). The address inputs also provide
the op-code during Mode Register Set command.
Row address: A0?A1 2.
Column address: A0?A9.
Auto-precharge: A10 is sampled during Read/Write commands to
determine whether Auto-precharge should be performed to the
accessed bank after the Read/Write operation.
L7
A10/AP
Input
(HIGH: Auto-precharge; LOW: no Auto-precharge). A10 is sampled
during a Precharge command to determine whether the Precharge
applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one
bank is to be precharged, the bank is selected by bank addresses.
Burst Chop: A12/BC# is sampled during Read and Write commands to
N7
A12/BC#
Input
determine if burst chop (on-the-fly) will be performed.
(HIGH, no burst chop; LOW: burst chopped). See section 9.1
“ Command Truth Table ” on Page 94 for details.
Active Low Asynchronous Reset: Reset is active when RESET# is
LOW, and inactive when RESET# is HIGH. RESET# must be HIGH
T2
RESET#
Input
during normal operation. RESET# is a CMOS rai to rail signal with DC
high and low at 80% and 20% of V DD , RESET# active is destructive to
data contents.
Publication Release Date: Dec. 09, 2013
Revision A05
-9-
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| W631GG6KB-15 | 功能描述:IC DDR3 SDRAM 1GBIT 96WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W631GG8KB-11 | 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 78WBGA |
| W631GG8KB-12 | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR3 SDRAM 1G-Bit 128Mx8 1.5V 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 78WBGA |
| W631GG8KB-15 | 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 制造商:Winbond Electronics Corp 功能描述:IC DDR3 SDRAM 1GBIT 78WBGA |
| W632 | 制造商:LUMINIS 制造商全称:LUMINIS 功能描述:Wall mount |
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