参数资料
型号: W631GG6KB-12
厂商: Winbond Electronics
文件页数: 132/159页
文件大小: 0K
描述: IC DDR3 SDRAM 1GBIT 96WBGA
标准包装: 200
格式 - 存储器: RAM
存储器类型: DDR3 SDRAM
存储容量: 1G(64M x 16)
速度: 800MHz
接口: 并联
电源电压: 1.425 V ~ 1.575 V
工作温度: 0°C ~ 85°C
封装/外壳: 96-TFBGA
供应商设备封装: 96-WBGA(9x13)
包装: 托盘
W631GG6KB
10.13.2 I DD Current Specifications
Speed Bin
DDR3-1333
DDR3-1600
DDR3-1866
SYM.
Part Number Extension
DEFINITION
-15/15I/15A/15K -12/12I/12A/12K
MAX.
MAX.
-11
MAX.
UNIT
I DD0
I DD1
I DD2N
I DD2NT
I DD2P0
I DD2P1
I DD2Q
I DD3N
I DD3P
I DD4R
I DD4W
I DD5B
I DD6
I DD6ET
I DD7
I DD8
Operating One Bank Active-Precharge
Current
Operating One Bank Active-Read-
Precharge Current
Precharge Standby Current
Precharge Standby ODT Current
Precharge Power Down Current Slow Exit
Precharge Power Down Current Fast Exit
Precharge Quiet Standby Current
Active Standby Current
Active Power Down Current
Operating Burst Read Current
Operating Burst Write Current
Burst Refresh Current
Self-Refresh Current, T OPER = 0 - 85°C
Self-Refresh Current, T OPER = 0 - 95°C
Operating Bank Interleave Read Current
RESET# Low Current
105
130
75
90
14
35
70
75
65
240
190
160
14
17
380
14
115
145
80
105
14
40
80
85
75
280
220
170
14
17
400
14
130
165
85
120
14
45
90
95
85
330
260
185
14
17
430
14
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Notes:
1. Max. values for I DD currents consider worst case conditions of process, temperature and voltage.
2. The I DD values must be derated (increased) when operated outside the range 0°C ≤ T CASE ≤ 85°C:
(a) When T CASE < 0°C: I DD2P0 , I DD2P1 and I DD3P must be derated by 4%; I DD4R and I DD5W must be derated by 2%; and
I DD6 , I DD6ET and I DD7 must be derated by 7%.
(b) When T CASE > 85°C: I DD0 , I DD1 , I DD2N , I DD2NT , I DD2Q , I DD3N , I DD3P , I DD4R , I DD4W , and I DD5B must be derated by
2%; and I DD2P0 , I DD2P1 must be derated by 30%.
Publication Release Date: Dec. 09, 2013
Revision A05
- 132 -
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