参数资料
型号: PH28F128W18BD60A
厂商: INTEL CORP
元件分类: PROM
英文描述: 8M X 16 FLASH 1.8V PROM, 60 ns, PBGA56
封装: 9 X 11 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-56
文件页数: 22/106页
文件大小: 1496K
代理商: PH28F128W18BD60A
Intel
Wireless Flash Memory (W18)
07-Dec-2005
Intel Wireless Flash Memory (W18)
Datasheet
22
Order Number: 290701, Revision: 015
CLK
Input
CLOCK: Synchronizes the flash die with the system bus clock in synchronous read mode and
increments the internal address generator.
During synchronous read operations, addresses are latched on the rising edge of ADV#, or on the next
valid CLK edge with ADV# low, whichever occurs first.
In asynchronous mode, addresses are latched on the rising edge ADV#, or are continuously flow-
through when ADV# is kept asserted.
WAIT
Output
WAIT: Output signal.
Indicates invalid data during synchronous array or non-array flash reads. Read Configuration Register
bit 10 (RCR[10]) determines WAIT-asserted polarity (high or low). WAIT is High-Z if F-CE# is
deasserted; WAIT is not gated by F-OE#.
In synchronous array or non-array flash read modes, WAIT indicates invalid data when asserted
and valid data when deasserted.
In asynchronous flash page read, and all flash write modes, WAIT is asserted.
F-WP#
Input
FLASH WRITE PROTECT: Low-true input.
F-WP# enables/disables the lock-down protection mechanism of the selected flash die.
F-WP# low enables the lock-down mechanism where locked down blocks cannot be unlocked with
software commands.
F-WP# high disables the lock-down mechanism, allowing locked down blocks to be unlocked with
software commands.
ADV#
Input
ADDRESS VALID: Low-true input.
During synchronous flash read operations, addresses are latched on the rising edge of ADV#, or on
the next valid CLK edge with ADV# low, whichever occurs first.
In asynchronous flash read operations, addresses are latched on the rising edge of ADV#, or are
continuously flow-through when ADV# is kept asserted.
R-UB#
R-LB#
Input
RAM UPPER / LOWER BYTE ENABLES: Low-true input.
During RAM read and write cycles, R-UB# low enables the RAM high order bytes on D[15:8], and R-
LB# low enables the RAM low-order bytes on D[7:0].
R-UB# and R-LB# are available on stacked combinations with PSRAM or SRAM die and are RFU on
flash-only stacked combinations.
F-RST#
Input
FLASH RESET: Low-true input.
F-RST# low initializes flash internal circuitry and disables flash operations. F-RST# high enables flash
operation. Exit from reset places the flash in asynchronous read array mode.
P-Mode,
P-CRE
Input
P-Mode (PSRAM Mode): Low-true input.
P-Mode is used to program the Configuration Register, and enter/exit Low Power Mode of PSRAM die.
P-Mode is available on stacked combinations with asynchronous-only PSRAM die.
P-CRE (PSRAM Configuration Register Enable): High-true input.
P-CRE is high, write operations load the refresh control register or bus control register.
P-CRE is applicable only on combinations with synchronous PSRAM die.
P-Mode, P-CRE is an RFU on stacked combinations without PSRAM die.
F-VPP,
F-VPEN
Power
FLASH PROGRAM AND ERASE POWER: Valid F-VPP voltage on this ball enables flash program/
erase operations.
Flash memory array contents cannot be altered when F-VPP(F-VPEN) < VPPLK (VPENLK). Erase /
program operations at invalid F-VPP (F-VPEN) voltages should not be attempted. Refer to flash discrete
product datasheet for additional details.
F-VPEN (Erase/Program/Block Lock Enables) is not available for L18/L30 SCSP products.
F[2:1]-VCC
Power
FLASH LOGIC POWER: F1-VCC supplies power to the core logic of flash die #1; F2-VCC supplies
power to the core logic of flash die #2 and flash die #3. Write operations are inhibited when F-VCC <
VLKO. Device operations at invalid F-VCC voltages should not be attempted.
F2-VCC is available on stacked combinations with two or three flash dies, and is an RFU on stacked
combinations with only one flash die.
Table 6.
Signal Descriptions - QUAD+ Package (Sheet 2 of 3)
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