参数资料
型号: PH28F128W18BD60A
厂商: INTEL CORP
元件分类: PROM
英文描述: 8M X 16 FLASH 1.8V PROM, 60 ns, PBGA56
封装: 9 X 11 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-56
文件页数: 96/106页
文件大小: 1496K
代理商: PH28F128W18BD60A
Intel
Wireless Flash Memory (W18)
Datasheet
Intel Wireless Flash Memory (W18)
07-Dec-2005
Order Number: 290701, Revision: 015
9
1.0
Introduction
This datasheet contains information about the Intel
Wireless Flash Memory (W18) device family.
This section describes nomenclature used in the datasheet. Section 2.0 provides an overview of the
W18 flash memory device. Section 6.0, Section 7.0, and Section 8.0 describe the electrical
specifications for extended temperature product offerings. Ordering information can be found in
1.1
Nomenclature
Acronyms that describe product features or usage are defined here:
1.2
Conventions
The following list describes abbreviated terms and phrases used throughout this document:
APS
Automatic Power Savings
BBA
Block Base Address
CFI
Common Flash Interface
CUI
Command User Interface
DU
Don’t Use
EFP
Enhanced Factory Programming
FDI
Flash Data Integrator
NC
No Connect
OTP
One-Time Programmable
PBA
Partition Base Address
RCR
Read Configuration Register
RWE
Read-While-Erase
RWW
Read-While-Write
SCSP
Stacked Chip Scale Package
SRD
Status Register Data
VF BGA
Very-thin, Fine-pitch, Ball Grid Array
WSM
Write State Machine
“1.8 V”
Refers to the full VCC voltage range of 1.7 V – 1.95 V (except where noted) and
“VPP = 12 V” refers to 12 V ±5%.
Set
Refers to registers means the bit is a logical 1 and cleared means the bit is a logical 0.
Pin and signal
Often used interchangeably to refer to the external signal connections on the package
(ball is the term used for VF BGA).
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