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参数资料
| 型号： | YF80528KC017512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | MICRO, PGA-603 |
| 文件页数： | 105/116页 |
| 文件大小： | 2277K |
| 代理商： | YF80528KC017512 |
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Intel XeonTM Processor MP
Datasheet
89
6.1
Thermal Specifications
Table 34 specifies the thermal design power dissipation envelope for the processors. The processor
power listed in Table 34 is described in two ways; maximum power and thermal design power.
Analysis indicates that real applications are unlikely to cause the processor to consume the
maximum possible power consumption. Intel recommends that system thermal designs utilize the
Thermal Design Power indicated in Table 34 instead of “Maximum Processor Power.” Thermal
Design Power recommendations have been chosen through characterization of server and
workstation applications on the Intel Xeon processor MP.
The Thermal Monitor feature is intended to protect the processor from over heating on any high
power code that exceeds the recommendations in this table. For more details on the Thermal
Monitor feature, refer to Section 7.3. In all cases, the Thermal Monitor feature must be enabled for
the processor to be operating within specification. Table 34 also lists the maximum and minimum
processor temperature specifications for TCASE. A thermal solution should be designed to ensure the
temperature of the processor never exceeds these specifications.
NOTE:
1. These values are specified at VCC_MID =(VCC_MAX +VCC_MIN)/2 for all processor frequencies and cache sizes.
Systems must be designed to ensure that the processor not be subjected to any static VCC and ICC combination wherein
VCC exceeds VCC_MID +0.200 *(1-ICC/ICC_MAX) [V]. Moreover, Vcc should never exceed VCC_MAX (VID). Failure to
adhere to this specification can shorten the processor lifetime.
2. Maximum Processor Power is the maximum thermal power that can be dissipated by the processor through the
integrated heat spreader.
3. Intel recommends that thermal solutions be designed utilizing the Thermal Design Power values. Refer to the Intel
Xeon
TM Processor MP Family Thermal Design Guidelines or the Intel XeonTM Processor Thermal Design Guidelines
for more details.
Table 34. Power and Thermal Specifications
Core Frequency
Maximum
Processor Power 2
(W)
Thermal Design
Power 3
(W)
Minimum
TCASE
(°C)
Maximum
TCASE
(°C)
Notes
1
1MB L3 Cache
1.4 GHz
78
65
5
75
1.5 GHz
82
68
5
76
1.6 GHz
87
72
5
78
512KB L3 Cache
1.4 GHz
78
65
5
75
1.5 GHz
82
68
5
76
1.6 GHz
87
72
5
78
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