参数资料
型号: YF80528KC017512
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA603
封装: MICRO, PGA-603
文件页数: 69/116页
文件大小: 2277K
代理商: YF80528KC017512
Intel XeonTM Processor MP
56
Datasheet
Figure 28 details the flatness and tilt specifications for the IHS of the Intel Xeon processor MP. Tilt
is measured with the reference datum set to the bottom of the processor interposer.
4.2
Package Load Specifications
Table 28 provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should not be exceeded during heat sink assembly, mechanical stress testing, or
standard drop and shipping conditions. The heat sink attach solutions must not induce continuous
stress onto the processor with the exception of a uniform load to maintain the heat sink-to-
processor thermal interface. It is not recommended to use any portion of the processor interposer as
a mechanical reference or load bearing surface for thermal solutions.
NOTES:
1. This specification applies to a uniform compressive load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. These parameters are based on design characterization and not tested.
4. Dynamic loading specifications are defined assuming a maximum duration of 11ms.
Figure 28. MP Processor IHS Flatness and Tilt Drawing
Table 28. Package Dynamic and Static Load Specifications
Parameter
Max
Unit
Notes
Static
25
lbf
1, 2, 3
Dynamic
100
lbf
1, 3, 4
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