参数资料
型号: YF80528KC017512
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA603
封装: MICRO, PGA-603
文件页数: 107/116页
文件大小: 2277K
代理商: YF80528KC017512
Intel XeonTM Processor MP
90
Datasheet
6.2
Thermal Analysis
6.2.1
Measurements For Thermal Specifications
6.2.1.1
Processor Case Temperature Measurement
The maximum and minimum case temperature (TCASE) for the processor are specified above. These
temperature specifications are meant to ensure correct and reliable operation of the processor.
Figure 34 illustrates the thermal measurement point for T
CASE. This point is at the center of the
integrated heat spreader (IHS).
NOTE:
This drawing is not to scale, it is for reference only. For specific processor mechanical specifications, refer to
Figure 34. Locations for Case Temperature (TCASE) Thermocouple Placement
Measure from edge of processor interposer
Measure T
at this point.
CASE
Thermal grease should cover the
entire surface of the Integrated
Heat Spreader
26.70 mm
1.05 in.
22.86 mm
0.900 in.
MP Package
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