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| 型号： | YF80528KC017512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | MICRO, PGA-603 |
| 文件页数： | 14/116页 |
| 文件大小： | 2277K |
| 代理商： | YF80528KC017512 |
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Intel XeonTM Processor MP
110
Datasheet
8.3
Boxed Processor Requirements
8.3.1
Intel
Xeon Processor MP
This boxed processor and thermal solution meets corporate enabled keepout zones. Any board
designed to meet the corporate guidelines should be compatible with the boxed processor. No other
special platform or system design considerations are required for integrating the boxed Intel Xeon
processor MP.
8.4
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
8.4.1
Boxed Processor Cooling Requirements
The boxed processor will be directly cooled with a passive heatsink. For the passive heatsink to
effectively cool the boxed processor, it is critical that sufficient, unimpeded, cool air flow over the
heatsink of every processor in the system. Meeting the processor's temperature specification is a
function of the thermal design of the entire system, and ultimately the responsibility of the system
integrator. The processor temperature specification is found in Chapter 6.0.
It is important that
system integrators perform thermal tests to verify that the boxed processor is kept below its
maximum temperature specification in a specific baseboard and chassis.
At an absolute minimum, the boxed processor heatsink will require 500 Linear Feet per Minute
(LFM) of cool air flowing over the heatsink. The airflow must be directed from the outside of the
chassis directly over the processor heatsinks in a direction passing from one retention mechanism
to the other. See Figure 39 for the proper airflow direction. Directing air over the passive heatsink
of the boxed Intel Xeon processor can be done with auxiliary chassis fans, fan ducts, or other
techniques.
It is also recommended that the ambient air temperature of the chassis be kept at or below 45° C.
The air passing directly over the processor heatsink should not be preheated by other system
components (such as another processor), and should be kept at or below 45° C. Again, meeting the
processor's temperature specification is the responsibility of the system integrator. The processor
temperature specification is found in Chapter 6.0.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| YFA014C049ZA | 制造商:Panasonic Industrial Company 功能描述:CHASSIS |
| YFA054C022ZA | 制造商:Panasonic Industrial Company 功能描述:COVER |
| YFAW025 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
| YFAW025-02 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
| YFAW025-03 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
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