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参数资料
型号： YF80528KC017512
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA603
封装： MICRO, PGA-603
文件页数： 51/116页
文件大小： 2277K
代理商： YF80528KC017512
Contents
4
Datasheet
4.6
Processor Markings ............................................................................................ 57
4.7
Processor Pin-Out Diagrams .............................................................................. 59
5.0
Pin Listing and Signal Definitions..................................................................... 61
5.1
Processor Pin Assignments ................................................................................ 61
5.1.1
Pin Listing by Pin Name ......................................................................... 61
5.1.2
Pin Listing by Pin Number ...................................................................... 70
5.2
Signal Definitions ................................................................................................ 79
6.0
Thermal Specifications .......................................................................................... 88
6.1
Thermal Specifications........................................................................................ 89
6.2
Thermal Analysis................................................................................................. 90
6.2.1
Measurements For Thermal Specifications............................................ 90
6.2.1.1 Processor Case Temperature Measurement ............................ 90
7.0
Features ....................................................................................................................... 91
7.1
Power-On Configuration Options ........................................................................ 91
7.2
Clock Control and Low Power States.................................................................. 91
7.2.1
Normal State—State 1 ........................................................................... 91
7.2.2
AutoHALT Powerdown State—State 2 .................................................. 92
7.2.3
Stop-Grant State—State 3 ..................................................................... 92
7.2.4
HALT/Grant Snoop State—State 4 ........................................................ 93
7.2.5
Sleep State—State 5.............................................................................. 93
7.2.6
Bus Response During Low Power States .............................................. 94
7.3
Thermal Monitor .................................................................................................. 94
7.3.1
Thermal Diode........................................................................................ 95
7.4
System Management Bus (SMBus) Interface ..................................................... 95
7.4.1
Processor Information ROM (PIR) ......................................................... 96
7.4.2
Scratch EEPROM .................................................................................. 98
7.4.3
PIR and Scratch EEPROM Supported SMBus Transactions................. 99
7.4.4
SMBus Thermal Sensor ......................................................................... 99
7.4.5
Thermal Sensor Supported SMBus Transactions ................................ 100
7.4.6
SMBus Thermal Sensor Registers ....................................................... 102
7.4.6.1 Thermal Reference Registers ................................................. 102
7.4.6.2 Thermal Limit Registers .......................................................... 102
7.4.6.3 Status Register........................................................................ 102
7.4.6.4 Configuration Register............................................................. 103
7.4.6.5 Conversion Rate Registers ..................................................... 104
7.4.7
SMBus Thermal Sensor Alert Interrupt ................................................ 104
7.4.8
SMBus Device Addressing................................................................... 104
8.0
Boxed Processor Specifications ..................................................................... 107
8.1
Introduction ....................................................................................................... 107
8.2
Mechanical Specifications................................................................................. 108
8.2.1
Boxed Processor Heatsink Dimensions ............................................... 108
8.2.2
Boxed Processor Heatsink Weight....................................................... 108
8.2.3
Boxed Processor Retention Mechanism and Heatsink Supports......... 108
8.3
Boxed Processor Requirements ....................................................................... 110
8.3.1
Intel Xeon Processor MP ............................................................... 110
8.4
Thermal Specifications...................................................................................... 110
8.4.1
Boxed Processor Cooling Requirements ............................................. 110
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