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| 型号： | YF80528KC017512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | MICRO, PGA-603 |
| 文件页数： | 18/116页 |
| 文件大小： | 2277K |
| 代理商： | YF80528KC017512 |
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Intel XeonTM Processor MP
114
Datasheet
9.2
Target System Implementation
9.2.1
System Implementation
Specific connectivity and layout guidelines for the Debug Port are provided in the
ITP700 Debug
Port Design Guide. Refer to Section 1.2.
9.3
Logic Analyzer Interface (LAI)
Two vendors provide logic analyzer interfaces (LAIs) for use in debugging Intel Xeon processor-
based systems. Tektronix* and Agilent* should be contacted to get specific information about their
logic analyzer interfaces. The following information is general in nature. Specific information must
be obtained from the logic analyzer vendor.
Due to the complexity of Intel Xeon processor-based multiprocessor systems, the LAI is critical in
providing the ability to probe and capture system bus signals using a logic analyzer. There are two
sets of considerations to keep in mind when designing a Intel Xeon processor-based system that
can make use of an LAI: mechanical and electrical.
9.3.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may include space normally occupied by the
heatsink. If this is the case, the logic analyzer vendor will provide a cooling solution as part of the
LAI.
9.3.2
Electrical Considerations
The LAI will also affect the electrical performance of the system bus, therefore it is critical to
obtain electrical load models from each of the logic analyser vendors to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| YFA014C049ZA | 制造商:Panasonic Industrial Company 功能描述:CHASSIS |
| YFA054C022ZA | 制造商:Panasonic Industrial Company 功能描述:COVER |
| YFAW025 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
| YFAW025-02 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
| YFAW025-03 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
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