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4 MEG x 16, 2 MEG x 16
ASYNC/PAGE/BURST CellularRAM MEMORY
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
Burst CellularRAM_2.fm - Rev. D 9/04 EN
29
2003 Micron Technology, Inc. All rights reserved.
NOTE:
1. All tests are performed with the outputs configured for full drive strength (BCR[5] = 0).
2. When configured for synchronous mode (BCR[15] = 0), a refresh opportunity must be provided every tCEM. A refresh
opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for greater than
15ns.
3. Clock rates below 50 MHz (tCLK > 20ns) are allowed as long as tCSP specifications are met.
4. Low-Z to High-Z timings are tested with the circuit shown in
Figure 23 on page 27. The High-Z timings measure a 100mV
transition from either VOH or VOL toward VCCQ/2.
5. High-Z to Low-Z timings are tested with the circuit shown in
Figure 23 on page 27. The Low-Z timings measure a 100mV
transition away from the High-Z (VCCQ/2) level toward either VOH or VOL.
Table 15:
Burst READ Cycle Timing Requirements
PARAMETER1
SYMBOL
-701
-708
-706/-856
UNITS
NOTES
MIN
MAX
MIN
MAX
MIN
MAX
Burst to READ Access Time
tABA
35
46.5
56
ns
CLK to Output Delay
tACLK
79
11
ns
Burst OE# LOW to Output Delay
tBOE
20
ns
CE# HIGH between Subsequent
Mixed-Mode Operations
tCBPH
55
5
ns
2
Maximum CE# Pulse Width
tCEM
88
8
s
2
CE# LOW to WAIT Valid
tCEW
17.517.517.5
ns
CLK Period
tCLK
9.62
20
12.5
20
15
20
ns
3
CE# Setup Time to Active CLK Edge
tCSP
4
20
4.5
20
5
20
ns
Hold Time from Active CLK Edge
tHD
22
2
ns
Chip Disable to DQ and WAIT High-Z
Output
tHZ
8
ns
4
CLK Rise or Fall Time
tKHKL
1.6
1.8
2.0
ns
CLK to WAIT Valid
tKHTL
79
11
ns
CLK to DQ High-Z Output
tKHZ
3
8383
8
ns
4
CLK to Low-Z Output
tKLZ
2
5252
5
ns
5
Output HOLD from CLK
tKOH
2
ns
CLK HIGH or LOW Time
tKP
3
4
5
ns
Output Disable to DQ High-Z Output
tOHZ
8
ns
4
Output Enable to Low-Z Output
tOLZ
5
ns
5
Setup Time to Active CLK Edge
tSP
3
ns