参数资料
型号: MT45W2MW16BBB-856WT
元件分类: SRAM
英文描述: 2M X 16 PSEUDO STATIC RAM, 85 ns, PBGA54
封装: 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, LEAD FREE, VFBGA-54
文件页数: 50/56页
文件大小: 709K
代理商: MT45W2MW16BBB-856WT
4 MEG x 16, 2 MEG x 16
ASYNC/PAGE/BURST CellularRAM MEMORY
09005aef80be1fbd pdf/09005aef80be2036 zip
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Burst CellularRAM_2.fm - Rev. D 9/04 EN
54
2003 Micron Technology, Inc. All rights reserved.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
All other trademarks are the property of their respective owners.
Figure 46: 54-Ball VFBGA
NOTE:
1. All dimensions in millimeters; MAX/MIN, or typical, as noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
Data Sheet Designation
Released (No Marking): This data sheet contains
minimum and maximum limits specified over the
complete power supply and temperature range for
production devices. Although considered final, these
specifications are subject to change, as further product
development and data characterization sometimes
occur.
BALL A1 ID
0.70 ±0.05
SEATING PLANE
0.10 C
C
1.00 MAX
BALL A6
BALL A1
BALL A1 ID
0.75
TYP
0.75 TYP
1.875
3.75
6.00 ±0.10
3.00 ±0.05
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS 0.35.
54X 0.37
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag or
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: 0.30 SOLDER MASK DEFINED
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
6.00
3.00
4.00 ±0.05
8.00 ±0.10
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