4 MEG x 16, 2 MEG x 16
ASYNC/PAGE/BURST CellularRAM MEMORY
09005aef80be1fbd pdf/09005aef80be2036 zip
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Burst CellularRAM_2.fm - Rev. D 9/04 EN
8
2003 Micron Technology, Inc. All rights reserved.
Part-Numbering Information
Micron CellularRAM devices are available in several
different configurations and densities (see
Figure 2).Figure 2: Part Number Chart
NOTE:
1. -30°C exceeds the CellularRAM Workgroup 1.0 specification of -25°C.
Valid Part Number Combinations
After building the part number from the part num-
bering chart, please go to the Micron Part Marking
Decoder Web site at
search to verify that the part number is offered and
valid. If the device required is not on this list, please
contact the factory.
Device Marking
Due to the size of the package, the Micron standard
part number is not printed on the top of the device.
Instead, an abbreviated device mark comprised of a
five-digit alphanumeric code is used. The abbreviated
device marks are cross-referenced to the Micron part
view the location of the abbreviated mark on the
device, please refer to customer service note, CSN-11,
MT 45
W 4M W
16
B
FB -70
6
WT ES
Micron Technology
Product Family
45 = PSRAM/CellularRAM Memory
Operating Core Voltage
W = 1.70V–1.95V
Address Locations
M = Megabits
Operating Voltage
W = 1.70V–3.30V
Bus Configuration
16 = x16
READ/WRITE Operation Mode
B = Asynchronous/Page/Burst
Package Codes
FB = VFBGA (6 x 9 grid, 0.75mm pitch, 6.0mm x 8.0mm x 1.0mm) 54-ball
BB = Lead-free VFBGA (6 x 9 grid, 0.75mm pitch, 6.0mm x 8.0mm x 1.0mm) 54-ball (contact factory)
Production Status
Blank = Production
ES = Engineering Sample
MS = Mechanical Sample
Operating Temperature
WT = -30C to +85C (see Note 1)
IT = -40 to +85C (contact factory)
Standby Power Options
Blank = Standard
L = Low Power
Frequency
6 = 66 MHz
8 = 80 MHz
1 = 104 MHz (contact factory)
Access/Cycle Time
60 = 60ns (contact factory)
70 = 70ns
85 = 85ns