参数资料
型号: M-ORSO82G51BM680-DB
厂商: LATTICE SEMICONDUCTOR CORP
元件分类: FPGA
英文描述: FPGA, 1296 CLBS, 333000 GATES, PBGA680
封装: PLASTIC, FBGA-680
文件页数: 25/123页
文件大小: 2207K
代理商: M-ORSO82G51BM680-DB
Lattice Semiconductor
ORCA ORSO82G5 Data Sheet
120
Package Parasitics
The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the
package parasitics. Table 38 lists eight parasitics associated with the ORCA packages. These parasitics represent
the contributions of all components of a package, which include the bond wires, all internal package routing, and
the external leads.
Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual
inductance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and
inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the near-
est neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed
to be grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading
effect of the lead. Resistance values are in m.
The parasitic values in Table 38 are for the circuit model of bond wire and package lead parasitics. If the mutual
capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be
added to each of the C1 and C2 capacitors.
Table 38. ORCA ORSO82G5 Package Parasitics
Figure 50. Package Parasitics
Package Type
LSW
LMW
RW
C1
C2
CM
LSL
LML
680-Pin PBGAM
3.8
1.3
250
1.0
0.3
2.8—5
0.5—1
PAD N
LSW
RW
CIRCUIT
BOARD PAD
CM
C1
LSW
RW
LSL
LMW
C2
C1
LML
C2
LSL
PAD N + 1
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