- 您现在的位置：买卖IC网 > PDF目录1916 > DS34S132GN+ (Maxim Integrated Products)IC TDM OVER PACKET 676-BGA PDF资料下载
参数资料
| 型号： | DS34S132GN+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 132/194页 |
| 文件大小： | 0K |
| 描述： | IC TDM OVER PACKET 676-BGA |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 40 |
| 功能： | TDM-over-Packet（TDMoP） |
| 接口： | TDMoP |
| 电路数： | 1 |
| 电源电压： | 1.8V, 3.3V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 676-BGA |
| 供应商设备封装： | 676-PBGA（27x27） |
| 包装： | 管件 |
| 其它名称： | 90-34S13+2N0 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页当前第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页第188页第189页第190页第191页第192页第193页第194页
DS34S132 DATA SHEET
19-4750; Rev 1; 07/11
42 of 194
Table 9-5. CAS Translation using RDAT and TDAT
TXP Direction
RXP Direction
SCTXDFSE to
PRCR1.MFS
TDM Port RDAT
TXP Packet Out
RXP Packet In
TDM Port TDAT
PTCR1.MFS
Format
Frm 1-12
Frm 13-24
Frm 1-12
Frm 13-24
Format
ESF to SF A1B1C1D1
A1B1A1B1
A1B1
SF
SF to ESF A1B1
A2B2
A1B1CD
ESF
SF to SF
A1B1
A2B2
A1B1A2B2
A1B1
A2B2
SF
ESF to ESF A1B1C1D1
A1B1C1D1
ESF
E1 to E1
A1B1C1D1
E1
Special considerations:
Each system should be analyzed to determine whether the 2-bit to 4-bit translation function is appropriate. The
method of appending a fixed, programmed “CD” value in one direction (SF to ESF) and discarding the “CD” bits in
the other direction (ESF to SF) may not be valid.
In applications where T1-SF CAS Signaling is carried in RXP packets, because the S132 stores 24 frames of T1-
SF CAS Signaling, it is possible (during a loss of RXP packet condition) that a constantly alternating 2-bit CAS code
(A1B1 ≠ A2B2) is transmitted at the TDM Port if the last 2 received AB CAS-codes are 2 different values, the Jitter
Buffer underruns (e.g. RXP packet fault) and the CAS “Last Value” function is enabled (B.BCDR1.SCRXBCSS).
This can occur, for example, if the far end of the PW transmitted an On-hook to Off-hook CAS Code transition in the
last received RXP packet. If this condition occurs (A1B1 ≠ A2B2), the TDM Port transmitted CAS codes will alternate
between these two values every 12 frames. Each system should be evaluated to determine whether this condition
is acceptable (an external T1 Framer with CAS debounce function should filter out the alternating pattern).
The support of CAS Signaling in a system that allows the use of multiple Nx64 PWs with a single T1/E1 may
require the system to be compliant with the defect and alarm requirements of a Digital Cross-Connect. When a
T1/E1 is divided into multiple segment/paths, the segments are unable to use the T1/E1 framing as an indication of
the state of the connection. For example if 2 PWs are merged into a single T1/E1, a far end T1/E1 fault in the RXP
direction of PW #1 (e.g. LOS) cannot be directly communicated over the local, T1/E1 transmit port since that would
imply that PW #2 is experiencing the same fault (i.e. the local T1/E1 transmit Port cannot forward the T1/E1-AIS,
Alarm Indication Signal, for PW #1 without indicating the same for PW #2; some systems allow DS0-AIS). Each
system should be analyzed to determine whether Digital Cross-Connect defect and alarm conditioning is required.
If these functions are required, they should be implemented external to the S132 (e.g. in the T1/E1 Framer).
9.2.4.2 TSA Block Loopbacks
The TSA Timeslots can be programmed to loopback data using a Bundle Loopback, TDM Port Line Loopback or
TDM Port Timeslot Loopback (see Figure 9-13). Any number of Timeslots, Bundles and/or TDM Ports can be in
Loopback at the same time.
The Bundle Loopback sends packet payload data that has been received for an RXP Bundle back toward the
Ethernet Port in TXP packets for the same Bundle. When the Bundle Loopback is enabled (Pn.PTCR3.RXTXTSL),
the RXP packet payload data is processed as though it will be transmitted at a TDM Port. But when the payload
data reaches the TSA block the data is looped back in the TXP direction and processed as though the data was
received from the TDM port. To work properly all Timeslots associated with the Bundle should be programmed into
the Bundle Loopback state.
The TDM Port Line Loopback and TDM Port Timeslot Loopback send payload data from the receive TDM Port back
toward the transmit TDM Port without any packet processing functions. The TDM Port Timeslot Loopback
(Pn.PTCR3.PRPTTSL) allows loopback selection on a per-Timeslot basis while the TDM Port Line Loopback
(Pn.PTCR2.PRPTLL) provides a loopback of all Receive TDM Port Data.
9.2.5 TDM Port Data Processing Engines
A TDM Port is assigned to a Bundle using B.BCDR4.PNS. The format of the TDM Port data streams can be
Unstructured, Structured T1/E1 without CAS or Structured T1/E1 with CAS and are processed using 3 engine
types: HDLC, SAT/CES and Clock Recovery. The combination of B.BCDR1.PMT (Payload Engine Type),
B.BCDR3.TXBTS (TXP Bundle Structure), B.BCDR4.RXBTS (RXP Bundle Structure) and B.BCDR4.PCRE (Clock
Recovery Enable) select the payload format and engine type for each Bundle. Enabling a particular Engine Type for
相关PDF资料 |
PDF描述 |
|---|---|
| DS34T102GN+ | IC TDM OVER PACKET 484TEBGA |
| DS3501U+H | IC POT NV 128POS HV 10-USOP |
| DS3502U+ | IC POT DGTL NV 128TAP 10-MSOP |
| DS3503U+ | IC POT DGTL NV 128TAP 10-MSOP |
| DS3897MX | IC TXRX BTL TRAPEZIODAL 20-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS34S132GN+ | 功能描述:通信集成电路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 类型:Transport Devices 封装 / 箱体:TECSBGA-256 数据速率:100 Mbps 电源电压-最大:1.89 V, 3.465 V 电源电压-最小:1.71 V, 3.135 V 电源电流:50 mA, 225 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装:Tube |
| DS34S132GNA2+ | 功能描述:通信集成电路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 类型:Transport Devices 封装 / 箱体:TECSBGA-256 数据速率:100 Mbps 电源电压-最大:1.89 V, 3.465 V 电源电压-最小:1.71 V, 3.135 V 电源电流:50 mA, 225 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装:Tube |
| DS34T101 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_08 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_09 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
发布紧急采购，3分钟左右您将得到回复。