- 您现在的位置：买卖IC网 > PDF目录1916 > DS34S132GN+ (Maxim Integrated Products)IC TDM OVER PACKET 676-BGA PDF资料下载
参数资料
| 型号： | DS34S132GN+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 134/194页 |
| 文件大小： | 0K |
| 描述： | IC TDM OVER PACKET 676-BGA |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 40 |
| 功能： | TDM-over-Packet（TDMoP） |
| 接口： | TDMoP |
| 电路数： | 1 |
| 电源电压： | 1.8V, 3.3V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 676-BGA |
| 供应商设备封装： | 676-PBGA（27x27） |
| 包装： | 管件 |
| 其它名称： | 90-34S13+2N0 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页当前第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页第188页第189页第190页第191页第192页第193页第194页
DS34S132 DATA SHEET
19-4750; Rev 1; 07/11
44 of 194
Each HDLC Engine can be programmed to use MSbit or LSbit first transmission (BCDR1.SCSNRE). This function
does not specify which bits of the Timeslot are used (previous paragraphs), but instead specifies whether the MSbit
or LSbit of each HDLC coded byte is transmitted first (the byte order is always MSByte first). For example, if LSbit
transmission and 8-bit coding are selected, then the LSbit of each byte is transmitted first (in the “bit 8” position of
the Timeslot). If instead MSbit transmission and 8-bit coding are selected then the MSbit of each byte is transmitted
first (in “bit 8”). Most T1/E1 applications use MSbit first.
Each HDLC Bundle can be programmed to include a 16-bit, 32-bit or “no” FCS (B.BCDR1SCRXBCSS and
SCTXBCSS).
In the TXP direction the HDLC Engine receives data from a TDM Port and removes the HDLC encoding (HDLC
Flags and HDLC Control Characters). The de-encoded packet data is buffered until a complete packet has been
received. After the HDLC FCS has been verified to be correct, the packet is queued for transmission as the payload
of a TXP HDLC Bundle packet.
TXP HDLC Bundles can optionally include RTP and Control Word Headers (enabled using the TXP Header
Descriptor). For RTP and/or Control Word headers can use Sequence Numbers that are always “zero”, or are
constantly incremented by one with each successive packet (B.BCDR4.SCTXCE and B.BCDR1.SCTXDFSE).
When incremented Sequence Numbers are used the S132 can be programmed to skip or include the Sequence
Number = “zero” value when the Sequence Number reaches roll-over.
In the RXP direction, when the RXP Classifier identifies an error-free packet for an HDLC Bundle, the PW packet
header and FCS are removed and the PW packet payload is stored for later processing by the RXP HDLC Engine.
The HDLC Engine inserts a Flag (Packet Delimiter = 0x7E) in between each successive RXP Packet to identify the
start and stop of each packet. The G.GCR.RXHMFIS register specifies the minimum number of Flags that are
inserted in between 2 HDLC packets where RXHMFIS + 1 = minimum number of flags (e.g. RXHMFIS = 0 for 1
flag). When the HDLC Engine no longer has a packet to forward and the minimum number of flags have been
transmitted the HDLC engine inserts “Inter-frame Fill” into the outgoing HDLC data stream. The Inter-frame Fill
value can be programmed to 0x7E or 0xFF (B.BCDR4.SCLVI).
In the RXP direction the S132 does not provide re-ordering of mis-ordered HDLC packets, so the optional RTP
and/or Control Word Sequence Numbers received in packets for RXP HDLC Bundles are ignored.
The B.BCDR1.PMS register is used to define the largest Ethernet packet that is accepted for an RXP HDLC
Bundle. Packets with a size greater than PMS are discarded.
Special Considerations
The S132 does not provide special handling for CAS Signaling when a T1/E1 Port includes an RXP HDLC Bundle.
If CAS Signaling is enabled for the T1/E1 Port and if the “overwrite CAS on TDAT” is enabled, CAS values will be
written in Timeslot positions assigned to HDLC Bundles. To prevent this, the HDLC 7-bit Sampling format can be
used, or else TSIG can be used to provide the CAS values (disable the “Overwrite CAS on TDAT”). In the TXP
direction, the RSIG value and the SW TXP CAS functions are ignored by TXP HDLC Bundles.
9.2.5.1.1 SAT/CES Engine
The S132 includes 256 SAT/CES Engines, one for each of the 256 possible SAT/CES Bundles.
Figure 9-15. SAT/CES Engine Environment
DS34S132
TXP
TSA
RXP
TSA
TXP SAT/CES Engine
RXP SAT/CES Engine
Buffer
Manager
TDM
Connection
In the RXP direction, B.BCDR1.PMS specifies the expected packet payload size for each RXP Bundle (not
including the optional CAS bytes). For SAT applications, PMS specifies how many bytes; for CES applications, how
many frames. In the TXP direction, the PMS setting determines the amount of data that is included in the payload
of each TXP Bundle packet.
相关PDF资料 |
PDF描述 |
|---|---|
| DS34T102GN+ | IC TDM OVER PACKET 484TEBGA |
| DS3501U+H | IC POT NV 128POS HV 10-USOP |
| DS3502U+ | IC POT DGTL NV 128TAP 10-MSOP |
| DS3503U+ | IC POT DGTL NV 128TAP 10-MSOP |
| DS3897MX | IC TXRX BTL TRAPEZIODAL 20-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS34S132GN+ | 功能描述:通信集成电路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 类型:Transport Devices 封装 / 箱体:TECSBGA-256 数据速率:100 Mbps 电源电压-最大:1.89 V, 3.465 V 电源电压-最小:1.71 V, 3.135 V 电源电流:50 mA, 225 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装:Tube |
| DS34S132GNA2+ | 功能描述:通信集成电路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 类型:Transport Devices 封装 / 箱体:TECSBGA-256 数据速率:100 Mbps 电源电压-最大:1.89 V, 3.465 V 电源电压-最小:1.71 V, 3.135 V 电源电流:50 mA, 225 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装:Tube |
| DS34T101 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_08 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_09 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
发布紧急采购，3分钟左右您将得到回复。