Table 2: Addressing
Parameter
512 Meg x 4
256 Meg x 8
128 Meg x 16
Configuration
64 Meg x 4 x 8 banks
32 Meg x 8 x 8 banks
16 Meg x 16 x 8 banks
Refresh count
8K
Row addressing
32K (A[14:0])
16K (A[13:0])
Bank addressing
8 (BA[2:0])
Column addressing
2K (A[11, 9:0])
1K (A[9:0])
Figure 1: DDR3 Part Numbers
Package
82-ball 12.5mm x 15mm FBGA
78-ball 9mm x 11.5mm FBGA
78-ball 8mm x 10.5mm FBGA
96-ball 9mm x 14mm FBGA
JE
HX
DA
HA
Example Part Number: MT41J256M8JE-15:D
Configuration
512 Meg x 4
256 Meg x 8
128 Meg x 16
512M4
256M8
128M16
Speed Grade
tCK = 1.07ns, CL = 13
tCK = 1.25ns, CL = 11
tCK = 1.5ns, CL = 10
tCK = 1.5ns, CL = 9
tCK = 1.87ns, CL = 8
tCK = 1.87ns, CL = 7
-107
-125
-15
-15E
-187
-187E
-
Configuration
MT41J
Package
Speed
Revision
:D
:
Temperature
Commercial
Industrial temperature
{
None
IT
Note: 1. Not all options listed can be combined to define an offered product. Use the part catalog search on
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
2Gb: x4, x8, x16 DDR3 SDRAM
Features
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.