- 您现在的位置：买卖IC网 > PDF目录299522 > MT41J128M16HA-107:D 128M X 16 DDR DRAM, PBGA96 PDF资料下载
参数资料
| 型号： | MT41J128M16HA-107:D |
| 元件分类： | DRAM |
| 英文描述： | 128M X 16 DDR DRAM, PBGA96 |
| 封装： | 9 X 14 MM, LEAD FREE, FBGA-96 |
| 文件页数： | 195/210页 |
| 文件大小： | 12448K |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页第188页第189页第190页第191页第192页第193页第194页当前第195页第196页第197页第198页第199页第200页第201页第202页第203页第204页第205页第206页第207页第208页第209页第210页
20. The setup and hold times are listed converting the base specification values (to which
derating tables apply) to VREF when the slew rate is 1 V/ns. These values, with a slew rate
of 1 V/ns, are for reference only.
21. When the device is operated with input clock jitter, this parameter needs to be derated
by the actual tJITper (larger of tJITper (MIN) or tJITper (MAX) of the input clock (output
deratings are relative to the SDRAM input clock).
22. Single-ended signal parameter.
23. The DRAM output timing is aligned to the nominal or average clock. Most output param-
eters must be derated by the actual jitter error when input clock jitter is present, even
when within specification. This results in each parameter becoming larger. The follow-
ing parameters are required to be derated by subtracting tERR10PER (MAX): tDQSCK
(MIN), tLZ (DQS) MIN, tLZ (DQ) MIN, and tAON (MIN). The following parameters are re-
quired to be derated by subtracting tERR10PER (MIN): tDQSCK (MAX), tHZ (MAX), tLZ
(DQS) MAX, tLZ(DQ) MAX, and tAON (MAX). The parameter tRPRE (MIN) is derated by
subtracting tJITper (MAX), while tRPRE (MAX) is derated by subtracting tJITper (MIN).
24. The maximum preamble is bound by tLZDQS (MAX).
25. These parameters are measured from a data strobe signal (DQS, DQS#) crossing to its
respective clock signal (CK, CK#) crossing. The specification values are not affected by
the amount of clock jitter applied, as these are relative to the clock signal crossing.
These parameters should be met whether clock jitter is present.
26. The tDQSCKdll_dis parameter begins CL + AL - 1 cycles after the READ command.
27. The maximum postamble is bound by tHZDQS (MAX).
28. Commands requiring a locked DLL are: READ (and RDAP) and synchronous ODT com-
mands. In addition, after any change of latency tXPDLL, timing must be met.
29. tIS (base) and tIH (base) values are for a single-ended 1 V/ns control/command/address
slew rate and 2 V/ns CK, CK# differential slew rate.
30. These parameters are measured from a command/address signal transition edge to its
respective clock (CK, CK#) signal crossing. The specification values are not affected by
the amount of clock jitter applied as the setup and hold times are relative to the clock
signal crossing that latches the command/address. These parameters should be met
whether clock jitter is present.
31. For these parameters, the DDR3 SDRAM device supports tnPARAM (nCK) = RU(tPARAM
[ns]/tCK[AVG] [ns]), assuming all input clock jitter specifications are satisfied. For exam-
ple, the device will support tnRP (nCK) = RU(tRP/tCK[AVG]) if all input clock jitter specifi-
cations are met. This means that for DDR3-800 6-6-6, of which tRP = 5ns, the device will
support tnRP = RU(tRP/tCK[AVG]) = 6 as long as the input clock jitter specifications are
met. That is, the PRECHARGE command at T0 and the ACTIVATE command at T0 + 6 are
valid even if six clocks are less than 15ns due to input clock jitter.
32. During READs and WRITEs with auto precharge, the DDR3 SDRAM will hold off the inter-
nal PRECHARGE command until tRAS (MIN) has been satisfied.
33. When operating in DLL disable mode, the greater of 4CK or 15ns is satisfied for tWR.
34. The start of the write recovery time is defined as follows:
For BL8 (fixed by MRS and OTF): Rising clock edge four clock cycles after WL
For BC4 (OTF): Rising clock edge four clock cycles after WL
For BC4 (fixed by MRS): Rising clock edge two clock cycles after WL
35. RESET# should be LOW as soon as power starts to ramp to ensure the outputs are in High-
Z. Until RESET# is LOW, the outputs are at risk of driving and could result in excessive
current, depending on bus activity.
36. The refresh period is 64ms when TC is less than or equal to 85°C. This equates to an aver-
age refresh rate of 7.8125s. However, nine REFRESH commands should be asserted at
least once every 70.3s. When TC is greater than +85°C, the refresh period is 32ms. Al-
though JEDEC specifies tREFI as a MAX, Micron allows REFRESH commands to be burst
provided that the maximum refresh period is not violated.
2Gb: x4, x8, x16 DDR3 SDRAM
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
85
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.
相关PDF资料 |
PDF描述 |
|---|---|
| MT45W2MW16BBB-856WT | 2M X 16 PSEUDO STATIC RAM, 85 ns, PBGA54 |
| MT46H32M32LGCM-5IT:A | 32M X 32 DDR DRAM, 5 ns, PBGA90 |
| MT46HC32M16LFCX-75:B | 32M X 16 DDR DRAM, 7.5 ns, PBGA90 |
| MT46HC32M16LGCM-54IT:B | 32M X 16 DDR DRAM, 5.4 ns, PBGA90 |
| MT47H32M16BT-37VL:A | 32M X 16 DDR DRAM, 0.5 ns, PBGA92 |
相关代理商/技术参数 |
参数描述 |
|---|
发布紧急采购，3分钟左右您将得到回复。