Thermal Characteristics
Table 8: Thermal Characteristics
Parameter/Condition
Value
Units
Symbol
Notes
Operating case temperature
0 to +85
C
TC
0 to +95
°C
TC
Junction-to-case (TOP)
78-ball “HX”
3.9
°C/W
ΘJC
78-ball “DA”
tbd
82-ball “JE”
1.6
96-ball “HA”
tbd
Notes: 1. MAX operating case temperature. TC is measured in the center of the package.
2. A thermal solution must be designed to ensure the DRAM device does not exceed the
maximum TC during operation.
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum TC dur-
ing operation.
4. If TC exceeds +85°C, the DRAM must be refreshed externally at 2X refresh, which is a
3.9s interval refresh rate. The use of SRT or ASR (if available) must be enabled.
5. The thermal resistance data is based off of a number of samples from multiple lots and
should be viewed as a typical number.
Figure 13: Thermal Measurement Point
(L/2)
L
W
(W/2)
Tc test point
2Gb: x4, x8, x16 DDR3 SDRAM
Thermal Characteristics
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
31
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