参数资料
型号: MT41J128M16HA-107:D
元件分类: DRAM
英文描述: 128M X 16 DDR DRAM, PBGA96
封装: 9 X 14 MM, LEAD FREE, FBGA-96
文件页数: 145/210页
文件大小: 12448K
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页当前第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页第188页第189页第190页第191页第192页第193页第194页第195页第196页第197页第198页第199页第200页第201页第202页第203页第204页第205页第206页第207页第208页第209页第210页
Input Clock Frequency Change ...................................................................................................................... 123
Write Leveling ............................................................................................................................................... 125
Write Leveling Procedure ........................................................................................................................... 127
Write Leveling Mode Exit Procedure ........................................................................................................... 129
Initialization ................................................................................................................................................. 130
Mode Registers .............................................................................................................................................. 132
Mode Register 0 (MR0) .................................................................................................................................. 133
Burst Length ............................................................................................................................................. 133
Burst Type ................................................................................................................................................ 134
DLL RESET ................................................................................................................................................ 135
Write Recovery .......................................................................................................................................... 135
Precharge Power-Down (Precharge PD) ..................................................................................................... 136
CAS Latency (CL) ....................................................................................................................................... 136
Mode Register 1 (MR1) .................................................................................................................................. 137
DLL Enable/DLL Disable ........................................................................................................................... 137
Output Drive Strength ............................................................................................................................... 138
OUTPUT ENABLE/DISABLE ...................................................................................................................... 138
TDQS Enable ............................................................................................................................................. 138
On-Die Termination .................................................................................................................................. 139
WRITE LEVELING ..................................................................................................................................... 139
POSTED CAS ADDITIVE Latency ................................................................................................................ 139
Mode Register 2 (MR2) .................................................................................................................................. 141
CAS Write Latency (CWL) ........................................................................................................................... 141
AUTO SELF REFRESH (ASR) ...................................................................................................................... 142
SELF REFRESH TEMPERATURE (SRT) ....................................................................................................... 142
SRT vs. ASR ............................................................................................................................................... 143
DYNAMIC ODT ......................................................................................................................................... 143
Mode Register 3 (MR3) .................................................................................................................................. 144
MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 144
MPR Functional Description ...................................................................................................................... 145
MPR Register Address Definitions and Bursting Order ................................................................................ 146
MPR Read Predefined Pattern .................................................................................................................... 151
MODE REGISTER SET (MRS) Command ........................................................................................................ 151
ZQ CALIBRATION Operation ......................................................................................................................... 152
ACTIVATE Operation ..................................................................................................................................... 153
READ Operation ............................................................................................................................................ 155
WRITE Operation .......................................................................................................................................... 166
DQ Input Timing ....................................................................................................................................... 174
PRECHARGE Operation ................................................................................................................................. 176
SELF REFRESH Operation ............................................................................................................................. 176
Extended Temperature Usage ........................................................................................................................ 178
Power-Down Mode ....................................................................................................................................... 179
RESET Operation ........................................................................................................................................... 187
On-Die Termination (ODT) ........................................................................................................................... 189
Functional Representation of ODT ............................................................................................................. 189
Nominal ODT ........................................................................................................................................... 189
Dynamic ODT ............................................................................................................................................... 191
Functional Description .............................................................................................................................. 191
Synchronous ODT Mode ............................................................................................................................... 196
ODT Latency and Posted ODT ................................................................................................................... 196
Timing Parameters .................................................................................................................................... 196
ODT Off During READs .............................................................................................................................. 199
2Gb: x4, x8, x16 DDR3 SDRAM
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
MT45W2MW16BBB-856WT 2M X 16 PSEUDO STATIC RAM, 85 ns, PBGA54
MT46H32M32LGCM-5IT:A 32M X 32 DDR DRAM, 5 ns, PBGA90
MT46HC32M16LFCX-75:B 32M X 16 DDR DRAM, 7.5 ns, PBGA90
MT46HC32M16LGCM-54IT:B 32M X 16 DDR DRAM, 5.4 ns, PBGA90
MT47H32M16BT-37VL:A 32M X 16 DDR DRAM, 0.5 ns, PBGA92
相关代理商/技术参数
参数描述